MFR #:C665
EIS #:FURONC665X.5
MFR #:C665
EIS #:FURONC665X.5
Out of Stock
Min Qty:1
|Qty Increment:1
more info
Saint-Gobain copper C665 tape is designed for conductivity through the entire construction. The copper foil and acrylic adhesive are both electrically conductive and the release liner aids in die-cutting. - The EMI/RFI shielding seals components from radiating or leaking interference. Both tapes offer solvent resistance. Backing thickness of 0.0014 Inch.
$62.43 / Roll
Min Qty:1
|Qty Increment:1
more info
Saint-Gobain copper C665 tape is designed for conductivity through the entire construction. The copper foil and acrylic adhesive are both electrically conductive and the release liner aids in die-cutting. - The EMI/RFI shielding seals components from radiating or leaking interference. Both tapes offer solvent resistance. Backing thickness of 0.0014 Inch.
Product Options
Showing 2 out of 2 options
Width: 0.5 Inch | EIS Part #: FURONC665X.5 | $ / Roll | ||
Width: 0.125 Inch | EIS Part #: FURONC665X.125 | $ / Roll |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameTape
Trade NameFuron
SeriesC665
General Features
TypeSmooth
Design & Construction
Adhesive TypeAcrylic
Backing MaterialCopper Foil
ColorCopper
Performance Details
Adhesive Strength35 oz/Inch
Flame RetardantYes
Tensile Strength70 lb/Inch
Physical Properties
Width0.5 Inch
Core Size3 Inch
Length36 Yard
Thickness3.5 mil
Environmental Condition
Temperature Rating250 °F
Features
- Temperature rating of -40 to 250 °F
Applications
- For IC Chips, Electrical Cabinets, Cables Motors and Static Dissipation