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Electromagnetic compatibility (EMC) prevents EMI by correcting the operation of electronic devices that produce unintentional or potentially disruptive electromagnetic energy.

Electromagnetic Interference and Radio Frequency Interference refer to different types of electronic-based interference produced by different types of devices. 

  • Electromagnetic Interference (EMI) is produced by either non-radio electronics or other electronics and radio devices that do not receive EMI frequencies.
  • Radio Frequency Interference (RFI) is produced in electrical devices such as laptops, radios, and televisions that transmit and receive frequencies. 

EIS provides materials selection and die-cutting expertise for EMC/EMI/RFI shielding applications in electronics, including consumer electronics. These materials can be die-cut into components to protect sensitive electronics from internal emissions or to protect users from external device emissions.

    Electromagnetic shielding uses conductive or magnetic materials to block the field of electromagnetic energy in a given space—shielding designed to isolate electrical devices from their surroundings and minimize disruption from outside electromagnetic interruption.

    There are two categories of electromagnetic interference, Narrowband EMI or RFI interference and Broadband EMI and RFI interference. Narrowband interference is emitted from intended transmissions from electronic devices such as radios and TV stations, and mobile phones. Broadband interference stems from unintentional radiation from sources like power lines.

    EIS assists electronic engineers in complying with EMI/RFI shielding requirements for increased product functionality and protecting sensitive digital circuits from external EMI sources and containing emissions from the device. EIS often engineers the best customer solutions by using multiple top suppliers and techniques.

    Devices that can benefit from the additional protection of EMI/RFI Shielding include medical equipment, radios, computers, control components, and many other electronic devices that emit or can be affected by electrical waves. Materials that constitute EMI/RFI Shielding include electrical tape with aluminum and copper backings for grounding, bonding, and EMI shielding. Conductive and non-conductive adhesive systems are available. 

    EIS provides an extensive range of EMI/RFI shielding converted materials from industry-leading manufacturers. Our portfolio encompasses materials that are not only high-quality but also versatile in their application. These materials can be precision die-cut into specific shapes or expertly laminated to other products to meet the exacting requirements of a diverse range of industries and applications. 

    In addition to EMI/RFI Shielding, our fabricated materials are engineered to offer a broad spectrum of performance characteristics including thermal management solutions, efficient heat dissipation, and electrical insulation properties that are vital for maintaining the integrity of electrical components. Our materials and fabrication services serve various industries from electronics and telecommunications to automotive and aerospace. 

    Common EMI/RFI materials include:

    • Foil tapes  
    • Metal-filled elastomers
    • Copper foil tapes 
    • Conductive fabrics laminated with conductive adhesives
    • Absorbing materials and pads 

    At EIS, we understand the importance of delivering not just products, but also providing expertise and support. Our experienced team is ready to partner with you in selecting the right materials, designing effective solutions, and ensuring that your projects benefit from optimal performance and reliability.