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Dow Corning Q1-9226 Two-Part Thermally Conductive Adhesive, 2kg Kit, White

ID: DCQ1-9226X2KG Mfr ID: Q1-9226X2KG
Manufactured by: Dow Corning
Dow Corning Q1-9226 heat-cure, thermally conductive adhesives produce no by-products in the cure process, allowing their use in deep section and complete confinement. These adhesives will develop good, primerless adhesion to a variety of common substrates including metals, ceramics, epoxy laminate boards, reactive materials and filled plastics. Electronic devices are continually designed to deliver higher performance.

USD $529.33 / KT

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This item may be sold in units of 1.

  • Brand name :  Dowcorning
  • Series :  Q1-9226
  • Item Name :  Thermally Conductive Adhesive
  • Short Desc :  ADHESIVE,CONDUCTIVE,Q1-9226 A&B 2KG KIT
  • UNSPSC :  31201600

Especially in the area of consumer electronics, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of electronic devices is a primary concern of design engineers.

Performance Details
Full Cure Time 30 min at 150 deg C, 60 min at 100 deg C 
Elongation 124% 
Shear Strength 375 psi 
Tensile Strength 600 psi 
Design & Construction
Form Liquid 
Color White 
Cure Type Accelerated Heat Cure 
Electrical Properties
Dielectric Strength 630V/Mil 
Supporting Information
Applicable Materials Ceramics, Plastics, Polyesters 
Chemical Properties
Composition Silicone 
Specific Gravity 2.14 
Viscosity 48000 cP Part A, 43000 cP Part B 
Physical Properties
Container Size 2kg 
Container Type Kit 
Hardness 67 Shore A 

Dow Corning Q1-9226 Two-Part Thermally Conductive Adhesive, 2kg Kit, White Technical Data Sheet 

Dow Corning Q1-9226 Two-Part Thermally Conductive Adhesive, 2kg Kit, White Safety Data Sheet (SDS) 

Features :

  • Self-priming adhesion to many substrates
  • Long pot life for ease of use
  • Thermally conductive filler
  • Accelerated heat cure

Applications :

  • For Bonding Organic and Ceramic Substrates to Heat Sinks for Electronic Control Modules in Automotive Applications