The Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. - R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.
$24.89
- $68.14
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The Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. - R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.
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Container Size:
35 g
EIS Part #:
SN63R276-35G
$ / each
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Attributes
Features
Applications
Attributes
General Information
Item NameSolder Paste
SeriesR276-6337-87
General Features
Shelf Life6 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorSilver Gray
Flux TypeNo-Clean
FormPaste
Particle TypeType 3
Chemical Properties
Flux FormulaR276
Mesh Size-325/+500
Physical Properties
AlloySn63 Pb37
Container TypeSyringe
Odor/ScentMild
Environmental Condition
Melting Range183 °C
Supporting Information
Flux DesignatorROL0
RoHS Info2011/65/EU Directive
Features
Available with lead-free alloys
Capable of several thousands of dots per hr in high speed automated dispense equipment
Contains halogen
Compatible with Kester easy profile 256 stenciling solder paste
Excellent dispensing characteristics using 22 ga needles and type 3 powder
High activity on all substrates, including OSPs
Manufactured and packaged void-free to insure the most consistent dispensability available