MFR #:7010020310
EIS #:PH19-HM531-6236-90
Series #:HM531-6236-90
MFR #:7010020310
EIS #:PH19-HM531-6236-90
Series #:HM531-6236-90
The Kester HM531 is a halide-free, organic acid, water soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hr of stable stencil life, tack time and repeatable brick definition. HM531's robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. - The activator package in the HM531 is very aggressive and provides superior wetting to OSP-coated PCBs and PdAg components. The outstanding batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the HM531 an ideal water soluble solder paste for any application.
$157.22
- $199.65
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The Kester HM531 is a halide-free, organic acid, water soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hr of stable stencil life, tack time and repeatable brick definition. HM531's robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. - The activator package in the HM531 is very aggressive and provides superior wetting to OSP-coated PCBs and PdAg components. The outstanding batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the HM531 an ideal water soluble solder paste for any application.
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Container Type: Cartridge | Container Size: 600 g | Particle Type: Type 3 | EIS Part #: SN62HM531-600G | $ / Piece |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSolder Paste
SeriesHM531-6236-90
Features
- stencil life of 8+ hr
- Capable of 60+ min idle times in printing
- Capable of print speeds up to 150 mm/sec (6 Inch/sec)
- Contains halogen
- Compatible with enclosed print head systems
- Excellent anti-slump characteristics minimizing bridging defects
- Excellent solderability to a wide variety of metallizations, including palladium, leaving bright, shiny joints
- HM531 provides outstanding batch to batch consistency
- Minimal foam in wash systems
- Produces minimal voiding underneath BGA components
- Residues easily removed with hot DI water, even up to 48 hr after soldering
- Metals percentage of 90%
- Melting range of 179 to 189 °C
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications