Kester EP256HA-6337-90 Solder Paste, 500g Jar, Type 3
MFR #:70-0202-0510
EIS #:SN63EP256HA-500G
Series #:EP256HA-6337-90
MFR #:70-0202-0510
EIS #:SN63EP256HA-500G
Series #:EP256HA-6337-90
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EP256HA is also capable of stencil printing after downtimes of up to 90 min with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.
EP256HA is a no-clean, air or nitrogen reflow able solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations.
$107.66 / Piece
Min Qty:1
|Qty Increment:1
EP256HA is also capable of stencil printing after downtimes of up to 90 min with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.
EP256HA is a no-clean, air or nitrogen reflow able solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations.
Product Options
Showing 2 out of 2 options
Container Size: 600 g | Container Type: Cartridge | Particle Type: Type 3 | EIS Part #: SN63EP256HA-600G | $ / Cartridge | ||
Container Size: 500 g | Container Type: Jar | Particle Type: Type 3 | EIS Part #: SN63EP256HA-500G | $ / Piece |
- Attributes
- Applications
- Features
Attributes
General Information
Item NameSolder Paste
Trade NameKester
SeriesEP256HA-6337-90
Design & Construction
Particle TypeType 3
Physical Properties
Container Size500 g
Container TypeJar
Applications
- For Stencil Printing Applications
Features
- Contains halogen
- Capable of 90 min break times in printing
- Capable of off-pad printing with no solder balls after reflow
- Stable wetting behavior over a wide range of profiles
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4 mm (16 Mil) pitch with type 3 powder
- High activity on all substrates, including OSPs
- High print speeds to 200+ mm/sec (8+ Inch/sec)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hr
- Stencil life of 8+ hr (process dependent)
- Metals percentage of 90%
- Temperature rating of 21 to 25 deg C