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Kester RF741 No-Clean Rework Flux, 30g Syringe, Amber

The image shown is representative of the product family and may not specifically be the individual item.  The Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework and repair applications. RF741 has a gel-like consist…

MFR #:7025010003

EIS #:RF741-30GR

Series #:RF741

MFR #:7025010003

EIS #:RF741-30GR

Series #:RF741

Temporarily Out of Stock

Min Qty:1

  |  

Qty Increment:1

This product requires overnight transport (Mon-Fri).
Temperature sensitive products require cold pack during shipping.
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The Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework and repair applications. RF741 has a gel-like consistency and is easily applied by syringe dispensing. RF741 can be precisely dispensed onto a specific area that needs flux. After being dispensed, RF741 stays in place until soldering occurs. Traditional problems experienced with controlling the application of low solids, no-clean liquid fluxes are eliminated. RF741 has excellent performance in applications requiring a flux having good thermal stability such as surface mount component repair. RF741 is the ideal choice for QFP or BGA semi-automated rework operations. - In addition, RF741 is well suited for use with through hole repair operations where solder fountain or controlled solder reservoir is being used for selective component removal and repair. Residues that remain on surfaces after soldering are almost colorless, leaving a very cosmetically appealing repair. The residue has high electrical resistance and can be left on the assembly after soldering. Residues are compatible with all no-clean fluxes in the Kester product line. RF741 can be used in combinations with Kester no-clean cored wire solders and no-clean solder pastes, as well as no-clean liquid fluxes without any compatibility risks.
$22.47 / each

Min Qty:1

  |  

Qty Increment:1

This product requires overnight transport (Mon-Fri).
Temperature sensitive products require cold pack during shipping.
0
0
The Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework and repair applications. RF741 has a gel-like consistency and is easily applied by syringe dispensing. RF741 can be precisely dispensed onto a specific area that needs flux. After being dispensed, RF741 stays in place until soldering occurs. Traditional problems experienced with controlling the application of low solids, no-clean liquid fluxes are eliminated. RF741 has excellent performance in applications requiring a flux having good thermal stability such as surface mount component repair. RF741 is the ideal choice for QFP or BGA semi-automated rework operations. - In addition, RF741 is well suited for use with through hole repair operations where solder fountain or controlled solder reservoir is being used for selective component removal and repair. Residues that remain on surfaces after soldering are almost colorless, leaving a very cosmetically appealing repair. The residue has high electrical resistance and can be left on the assembly after soldering. Residues are compatible with all no-clean fluxes in the Kester product line. RF741 can be used in combinations with Kester no-clean cored wire solders and no-clean solder pastes, as well as no-clean liquid fluxes without any compatibility risks.

Attributes

General Information
Item NameRework Flux
SeriesRF741
General Features
Shelf Life12 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorAmber
Flux TypeNo-Clean
FormPaste
Chemical Properties
Chemical CompositionRosin, Propan-1-ol, Carnauba Wax, N-Methyl-2-Pyrrolidone
Flux FormulaRF741
Physical Properties
Container Size30g
Container TypeSyringe
Odor/ScentMild
Supporting Information
Flux DesignatorROL0
RoHS Info2015/863 Directive