The Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework and repair applications. RF741 has a gel-like consistency and is easily applied by syringe dispensing. RF741 can be precisely dispensed onto a specific area that needs flux. After being dispensed, RF741 stays in place until soldering occurs. Traditional problems experienced with controlling the application of low solids, no-clean liquid fluxes are eliminated. RF741 has excellent performance in applications requiring a flux having good thermal stability such as surface mount component repair. RF741 is the ideal choice for QFP or BGA semi-automated rework operations. - In addition, RF741 is well suited for use with through hole repair operations where solder fountain or controlled solder reservoir is being used for selective component removal and repair. Residues that remain on surfaces after soldering are almost colorless, leaving a very cosmetically appealing repair. The residue has high electrical resistance and can be left on the assembly after soldering. Residues are compatible with all no-clean fluxes in the Kester product line. RF741 can be used in combinations with Kester no-clean cored wire solders and no-clean solder pastes, as well as no-clean liquid fluxes without any compatibility risks.