In what is a true market break-through, Henkel has developed the first-ever temperature stable solder paste. Loctite GC 10 is stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance. LOCTITE® GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys.