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October Shop & Earn
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Kester 186 Rosin Mildly Activated Flux Pen, 1/3 oz

The image shown is representative of the product family and may not specifically be the individual item.  The Kester 186 flux pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 186 u…

MFR #:8310000186

EIS #:186-FLUXPEN

Series #:186FP

MFR #:8310000186

EIS #:186-FLUXPEN

Series #:186FP

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Min Qty:1

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Qty Increment:1

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The Kester 186 flux pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 186 under MIL-F-14256, was QPL approved as type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. - 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The flux residue is also moisture and fungus resistant.
$7.42 / each

Min Qty:1

  |  

Qty Increment:1

Additional fees may apply when shipped by AIR
0
0
The Kester 186 flux pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 186 under MIL-F-14256, was QPL approved as type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. - 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The flux residue is also moisture and fungus resistant.

Attributes

General Information
Item NameFlux Pen
Series186FP
General Features
Shelf Life24 Months
Storage Temperature10 to 25 °C
Design & Construction
ColorAmber
Flux TypeRosin Mildly Activated
FormLiquid
Performance Details
Vapor Pressure43 hPa
Vapor Density0.88 g/cc
Chemical Properties
Chemical CompositionIsopropanol, Rosin, Modified Benzyl Alcohol
Flux Formula186
Specific Gravity0.879
VOC562 g/L
Physical Properties
Container Size0.33 oz
Odor/ScentAlcohol
Supporting Information
Flux DesignatorROL0
RoHS Info2011/65/EU Directive
Flux Thinner120