MFR #:8310000186
EIS #:186-FLUXPEN
Series #:186FP
MFR #:8310000186
EIS #:186-FLUXPEN
Series #:186FP
Temporarily Out of Stock
Min Qty:1
|Qty Increment:1
Additional fees may apply when shipped by AIR
The Kester 186 flux pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 186 under MIL-F-14256, was QPL approved as type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. - 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The flux residue is also moisture and fungus resistant.
$7.42 / each
Min Qty:1
|Qty Increment:1
Additional fees may apply when shipped by AIR
The Kester 186 flux pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 186 under MIL-F-14256, was QPL approved as type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. - 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The flux residue is also moisture and fungus resistant.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameFlux Pen
Series186FP
General Features
Shelf Life24 Months
Storage Temperature10 to 25 °C
Design & Construction
ColorAmber
Flux TypeRosin Mildly Activated
FormLiquid
Performance Details
Vapor Pressure43 hPa
Vapor Density0.88 g/cc
Chemical Properties
Chemical CompositionIsopropanol, Rosin, Modified Benzyl Alcohol
Flux Formula186
Specific Gravity0.879
VOC562 g/L
Physical Properties
Container Size0.33 oz
Odor/ScentAlcohol
Supporting Information
Flux DesignatorROL0
RoHS Info2011/65/EU Directive
Flux Thinner120
Features
- High thermal stability
- Eliminates the need and expense of cleaning
- Improves soldering performance
- Contains halogen
- Vapor density of 0.88 g/cc at 20 °C
- Vapor pressure of 43 hPa at 20 °C
Applications
- For Rework of Conventional and Surface Mount Circuit Board Assemblies