MFR #:5520
EIS #:PH19-5520
Series #:5520
MFR #:5520
EIS #:PH19-5520
Series #:5520
The Kester 5520 cleaner is a non-fuming liquid solution for removing oxides, sulfides, carbonates and other contamination, such as etch residues, from copper metal surfaces to facilitate soldering. This stable solution cleans by dissolving or solubilizing the contamination for easy removal by water rinsing. The chemical cleaning action is quite different form strong mineral acids which etch away valuable base metal and passivate the surface by insoluble film formation. - 5520 contains a pink pH indicator which turns yellow at pH 3.5 indicating the solution has lost its efficiency. Because the etch rate is controlled, the bath life is very extended. 5520 will selectively remove surface contamination from copper or gold-plated surfaces with no appreciable metallic etching.
$69.09
- $83.95
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The Kester 5520 cleaner is a non-fuming liquid solution for removing oxides, sulfides, carbonates and other contamination, such as etch residues, from copper metal surfaces to facilitate soldering. This stable solution cleans by dissolving or solubilizing the contamination for easy removal by water rinsing. The chemical cleaning action is quite different form strong mineral acids which etch away valuable base metal and passivate the surface by insoluble film formation. - 5520 contains a pink pH indicator which turns yellow at pH 3.5 indicating the solution has lost its efficiency. Because the etch rate is controlled, the bath life is very extended. 5520 will selectively remove surface contamination from copper or gold-plated surfaces with no appreciable metallic etching.
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Container Size: 5 gal | EIS Part #: KES55205G | $ / US gallon | ||
Container Size: 53 gal | EIS Part #: KES552053G | $ / US gallon |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameCleaner
Series5520
General Features
Shelf Life24 Months
Storage Temperature4 to 25 °C
Design & Construction
ColorPink
FormLiquid
Chemical Properties
pH Rating1
Chemical CompositionGlycolic Acid, Ammonium Chloride, Nitrilotrimethylenetris(phosphonic acid), Citric Acid, Methoxyacetic Acid, Water
Physical Properties
Odor/ScentMild
Supporting Information
RoHS Info2011/65/EU Directive
Features
- Removes oxidation to facilitate soldering
- Easily cleaned in water
- Minimal etching
Applications
- For Copper and Copper alloys