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Zestron 0330-0025 Vigon SC 200 Stencil Cleaner Concentrate, 25 L

The image shown is representative of the product family and may not specifically be the individual item.  Vigon EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also …

MFR #:0330-0025

EIS #:0330-0025-ZES

Series #:SC 200

MFR #:0330-0025

EIS #:0330-0025-ZES

Series #:SC 200

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The MPC cleaner reliably removes solder pastes and SMT adhesives from SMT stencils and can also be used in SMT printers for underside wiping and misprinted assemblies. Depending on the type of fluxes, VIGON SC 200 can also be used for misprints on double-sided PCBAs with one side already soldered. The cleaning agent is designed for the use in spray-in-air and ultrasonic cleaning systems.
$1,242.54 / Can

Min Qty:1

  |  

Qty Increment:1

0
0
The MPC cleaner reliably removes solder pastes and SMT adhesives from SMT stencils and can also be used in SMT printers for underside wiping and misprinted assemblies. Depending on the type of fluxes, VIGON SC 200 can also be used for misprints on double-sided PCBAs with one side already soldered. The cleaning agent is designed for the use in spray-in-air and ultrasonic cleaning systems.

Product Options

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The image shown is representative of the product family and may not specifically be the individual item.  Vigon EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also …
Container Size
25 L
EIS Part #
0330-0025-ZES
$ / Can
The image shown is representative of the product family and may not specifically be the individual item.  Vigon EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also …
Container Size
5 L
EIS Part #
0320-0005-ZES
$ / Can

Attributes

General Information
Item NameStencil Cleaner
Trade NameVigon
SeriesSC 200
General Features
TypeWater-based stencil cleaner
StandardsIPC-7526 Manual for cleaning of stencils and misprinted boards
Net Weight25 L
Shelf LifeMinimum 5 years in factory sealed containers
Storage Temperature5 to 30 C
Design & Construction
Base TypeWater-based
FormLiquid
Application MaterialsSMT stencils, misprinted solder paste boards, double-sided PCBAs, printer undersides
Performance Details
RemovesSolder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers
Vapor Pressure18.1
Technical Details
Boiling Point95 to 212 C
Flash PointNone until boiling
Chemical Properties
DilutionConcentrate
pH RatingNeutral
Specific Gravity0.99 g/mL at 20 C
Physical Properties
Container Size25 L
Container TypeJerry Can
Density0.99 g/mL at 20 C
Odor/ScentLow Odor
Environmental Condition
Temperature Rating20 to 50 C
Supporting Information
Use WithSpray-in-air systems, ultrasonic dip tanks, SMT printers
Solubility In WaterSoluble