Von Roll/John C Dolph Dolphon® CB-1130-B Flame-Retardant Polybutadiene Resin Reactor
MFR #:Dolphon® CB-1130-B
EIS #:PH21-Dolphon CB-1130-B
MFR #:Dolphon® CB-1130-B
EIS #:PH21-Dolphon CB-1130-B
Von Roll/John C Dolph Dolphon® CB-1130-B Flame-Retardant Polybutadiene Resin Reactor, Room Temperature Cure Type, 8.9 - 9.3 lb/gal At 77 °F (25 °C) Density, 1000 V/Mil (ASTM D-149, 1/8 Inch Specimen) Dielectric Strength, 24 hr Full Cure Time, 55 Shore A (After 7 Days At Room Temperature Cure) Hardness, 10 (Parts By Weight) Mixing Ratio, 2.3 BTU/HR/ft²/Inch/°F (ASTM C-3111) Thermal Conductivity, 100 - 140 P At 77 °F (25 °C) Viscosity. - CB-1130 is formulated for potting, casting and coating electrical and electronic devices where a flexible, flame retardant material is required.
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Von Roll/John C Dolph Dolphon® CB-1130-B Flame-Retardant Polybutadiene Resin Reactor, Room Temperature Cure Type, 8.9 - 9.3 lb/gal At 77 °F (25 °C) Density, 1000 V/Mil (ASTM D-149, 1/8 Inch Specimen) Dielectric Strength, 24 hr Full Cure Time, 55 Shore A (After 7 Days At Room Temperature Cure) Hardness, 10 (Parts By Weight) Mixing Ratio, 2.3 BTU/HR/ft²/Inch/°F (ASTM C-3111) Thermal Conductivity, 100 - 140 P At 77 °F (25 °C) Viscosity. - CB-1130 is formulated for potting, casting and coating electrical and electronic devices where a flexible, flame retardant material is required.
Product Options
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 | Container Size: 8 lb | EIS Part #: DOLCB1130B8LB | $ / US pound | |
| Container Size: 1 lb | EIS Part #: DOLCB1130B1LB | $ / US pound |
- Attributes
- Features
- Applications
Attributes
General Information
Item NamePolybutadiene Resin Reactor
Trade NameDolphon®
SeriesDolphon® CB-1130-B
General Features
TypeFlame-Retardant
Design & Construction
ColorDark Amber
Cure TypeRoom Temperature
FormLiquid
Performance Details
Full Cure Time24 hr
Chemical Properties
Mixing Ratio10 (Parts By Weight)
Electrical Properties
Dielectric Strength1000 V/Mil
Physical Properties
Hardness55 Shore A (After 7 Days at Room Temperature Cure)
Features
- Flame retardant - meets UL 94VO
- Very flexible
- Excellent hydrolytic stability
- Excellent chemical resistance
- Low shrinkage
- Low embedment stress - protects delicate components
- Excellent thermal shock resistance, repairable, fast cure
- Exceptional protection in harsh environments
- Excellent for stress relief type applications
- Excellent adhesion, very low exothermic reaction
- 3.0 x 10^ 15 ohms (ASTM D-257) surface resistivity
- 6.0 x 10^16 ohm-cm (ASTM D-150) volume resistivity
- <0.01% shrinkage
- 2.29 at 25 °C, 60 Hz (ASTM D-150) dielectric constant
- 0.0003 at 25 °C, 60 Hz (ASTM D-150) dissipation factor
- Dielectric Strength: 1000 V/Mil (ASTM D-149, 1/8 Inch Specimen)
- Viscosity: 100 - 140 P at 77 °F/25 °C
- Density: 8.9 - 9.3 lb/gal at 77 °F (25 °C)
- Thermal Conductivity: 2.3 BTU/HR/ft²/Inch/°F (ASTM C-3111)
Applications
- Modules and Sensors
- Relays
- Coils
- Ferrite Cores
- Transformers
- Amplifiers
- Power Supplies
- Ground Fault Interrupters
- Electronic Assemblies
- Connectors
- Junction Boxes
- Splice Filling
- Cable Repair
- Motors
- Instrumentation
- High Voltage Power Supplies
- Power Converters