Zestron 0550-0025 Vigon A 200 Flux Remover, 25 L
MFR #:0550-0025
EIS #:0550-0025-ZES
MFR #:0550-0025
EIS #:0550-0025-ZES
Low Stock
Min Qty:1
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The water-based MPC cleaning medium removes all types of flux residues from electronic assemblies, ceramic hybrids, power modules and lead frames. It was specifically developed for the use in high and medium pressure spray equipment such as inline or batch machines, but it can also be used in dip tank processes.
$869.33 / Can
Min Qty:1
|Qty Increment:1
The water-based MPC cleaning medium removes all types of flux residues from electronic assemblies, ceramic hybrids, power modules and lead frames. It was specifically developed for the use in high and medium pressure spray equipment such as inline or batch machines, but it can also be used in dip tank processes.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameFlux Remover
Trade NameVigon
General Features
StandardsIPC-A-610, J-STD 001, IPC 5704, IPC-Hdbk-65B
Net Weight25 L
Shelf LifeMinimum 5 years in factory sealed containers
Storage Temperature5 to 30 C
Design & Construction
FormLiquid
Performance Details
RemovesRemoves all types of flux residues from electronic assemblies, ceramic hybrids, power modules and lead frames
Physical Properties
Container Size25 L
Container TypeDrum
Odor/ScentLow Odor
Supporting Information
For Use WithElectronic assemblies
Use WithInline and batch spray-in-air systems, dip tank equipment
Features
- Ensures highest cleanliness levels for subsequent wire bonding and coating steps, suitable for low standoffs
- Surfactant-free formulation and excellent rinseability, does not leave any residues on the surface
- Can easily be filtered and therefore provides an extended bath life and reduces cleaning agent costs
- Has no flash point and thus can be applied in all spray-in-air equipment without explosion proof
- Does not foam, even in high pressure applications
- Formulated free of halogenated compounds and has a low odor
Applications
- Removes all types of flux residues from electronic assemblies, ceramic hybrids, power modules and lead frames