MFR #:14260
EIS #:DEV14260
Series #:DEV-14
UPC #:00078143142604
MFR #:14260
EIS #:DEV14260
Series #:DEV-14
UPC #:00078143142604
Out of Stock
Min Qty:1
|Qty Increment:1
Devcon 2 Ton clear epoxy adhesive is compatible with ceramic, concrete, glass, metal and wood materials with a 16 hr cure time. Provides a 8 - 12 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2250 psi and peel strength of 2 to 3 piw. - Medium cure adhesive, which produces non shrinking, rigid bonds. Fills poorly mated joining surfaces while providing excellent adhesion. Water resistant. Good impact resistant. Can be used to encapsulate parts.
$30.61 / each
Min Qty:1
|Qty Increment:1
Devcon 2 Ton clear epoxy adhesive is compatible with ceramic, concrete, glass, metal and wood materials with a 16 hr cure time. Provides a 8 - 12 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2250 psi and peel strength of 2 to 3 piw. - Medium cure adhesive, which produces non shrinking, rigid bonds. Fills poorly mated joining surfaces while providing excellent adhesion. Water resistant. Good impact resistant. Can be used to encapsulate parts.
Product Options
Showing 2 out of 2 options
Container Size: 25mL | Container Type: Tube | EIS Part #: DEV14310 | $ / Piece Pack: 24/Carton | ||
Container Size: 50mL | Container Type: Cartridge | EIS Part #: DEV14260 | $ / each |
- Attributes
- Applications
- Documents
Attributes
General Information
Item NameEpoxy Adhesive
Trade Name2 Ton®
SeriesDEV-14
General Features
StandardsOSHA Approved, 29 CFR 1910.133 Certified
Design & Construction
Color - Part-AClear
Color - Part-BAmber
Cure TypeMedium Cure
Form - Part-ALiquid
Form - Part-BLiquid
Chemical Properties
Composition - Part-AEpoxy Resin
Composition - Part-BAliphatic Amine
Specific Gravity - Part-A1.17
Specific Gravity - Part-B0.97
Physical Properties
Container Size50mL
Container TypeCartridge
Hardness83 Shore D
Odor/Scent - Part-ASlight
Odor/Scent - Part-BAmmonia Like Fishy
Applications
- For Bonding Parts in a Structural Environment or Potting Electronic Components and Assemblies