Zestron 0614-0300 HC Aerosol – SMT Adhesive Cleaner, 300 mL
MFR #:0614-0300
EIS #:0614-0300-ZES
MFR #:0614-0300
EIS #:0614-0300-ZES
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ZESTRON HC is a modified alcohol-based cleaning agent designed to remove SMT adhesives from tools such as dispensing nozzles. ZESTRON HC can also be used for the removal of solder particles and dust from pick & place nozzels. It is supplied in an aerosol can for easy manual application.
$557.90 / Box
Min Qty:1
|Qty Increment:1
ZESTRON HC is a modified alcohol-based cleaning agent designed to remove SMT adhesives from tools such as dispensing nozzles. ZESTRON HC can also be used for the removal of solder particles and dust from pick & place nozzels. It is supplied in an aerosol can for easy manual application.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameAdhesive Removers
Trade NameZestron
General Features
Standards100% compliance with EU guidelines (RoHS 1, 2 & 3, WEEE)
Net Weight300 ml (aerosol can)
Shelf LifeMinimum 5 years in factory sealed containers
Storage Temperature5 to 30 C
Design & Construction
Base TypeModified alcohol
FormAerosol
Performance Details
Evaporation RateFast
Removal Time10 to 30 seconds
RemovesSMT adhesives, solder particles, dust from dispensing tools and pick & place nozzles
Chemical Properties
DilutionReady-to-use (pure)
Specific Gravity0.81 g/ccm at 20 C
Physical Properties
Container TypeAerosol Can
Supporting Information
Use WithDispensing nozzles, pick & place nozzles, tools
Features
- Reliably removes SMT adhesives from dispensing nozzles and tools
- Dries fast and residue-free
- ZESTRON HC does not contain any halogenated compounds
- The removable dispenser also allows easy cleaning of dispensing nozzles
- Also applicable for the removal of solder particles and dust from pick & place nozzles
Applications
- SMT adhesive removal from dispensing nozzles
- Cleaning pick & place nozzles
- Manual cleaning of solder particles and dust