Cytec K-230B Easypoxy® Conap® Epoxy Adhesive, Part B Hardener, Clear/Light Amber
MFR #:139801
EIS #:CONK230B
MFR #:139801
EIS #:CONK230B
Min Qty:1
|Qty Increment:1
Easypoxy K-230B is Part B in a two-component, 100% solid paste adhesive. Part A can be found here under EIS Part # CONK230A. This Optically Clear Kit system's cured resilience makes it excellent for bonding substrates with widely different coefficients of expansion and favors bonding elastomeric to rigid substrates. - Easypoxy K-230B is therefore often used in thin films to bond glass. Due to its neutral color this adhesive is desirable whenever bond lines must remain unnoticed.
Min Qty:1
|Qty Increment:1
Easypoxy K-230B is Part B in a two-component, 100% solid paste adhesive. Part A can be found here under EIS Part # CONK230A. This Optically Clear Kit system's cured resilience makes it excellent for bonding substrates with widely different coefficients of expansion and favors bonding elastomeric to rigid substrates. - Easypoxy K-230B is therefore often used in thin films to bond glass. Due to its neutral color this adhesive is desirable whenever bond lines must remain unnoticed.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
General Features
Design & Construction
Chemical Properties
Physical Properties
Features
- High bond strength
- Electrically insulating
- Room temperature or low heat cure
- Neutral color for less noticeable bond lines
- Non-flowing paste
Applications
General-purpose adhesive and repair compound for bonding of materials with widely different coefficients of thermal expansion.