Dow Corning 93-500 space grade encapsulate is a transparent, room-temperature-curing, solventless silicone material designed for potting, filling, embedding and encapsulating electronic and other equipment for use in the space environment. It is supplied as a nearly colorless, free flowing, low viscosity fluid. - Dow Corning 93-500 encapsulate sections of the encapsulant can be cut out for replacement of components, new encapsulant can be poured in place and cured to re-form a tight seal.
$2,208.08
- $2,268.15
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Dow Corning 93-500 space grade encapsulate is a transparent, room-temperature-curing, solventless silicone material designed for potting, filling, embedding and encapsulating electronic and other equipment for use in the space environment. It is supplied as a nearly colorless, free flowing, low viscosity fluid. - Dow Corning 93-500 encapsulate sections of the encapsulant can be cut out for replacement of components, new encapsulant can be poured in place and cured to re-form a tight seal.
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Container Size:
115g
EIS Part #:
DC93-500X115G
$ / Kit
Container Size:
110g
EIS Part #:
DC93-500X110G
$ / Kit
Page 1 of 1
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Attributes
Features
Applications
Attributes
General Information
Item NameEncapsulant Kit
Series93-500
General Features
TypeThixotropic, Space Grade
Shelf Life6 Months
Storage TemperatureBelow 32 °C
Design & Construction
Cure TypeRoom Temperature
FormLiquid
Performance Details
Tensile Strength790 psi
Chemical Properties
CompositionSilicone Elastomer
Specific Gravity1.08
Viscosity8000 cSt
Electrical Properties
Dielectric Strength570V/Mil
Physical Properties
Container TypeKit
Elongation110%
Hardness46 Shore A
Features
Transparency - embedded parts can be visually inspected
Good physical and electrical stability-retain properties from -65 to 200 °C (-85 to 392 °F), over a wide range of frequency and humidity
Good firmness and flexibility - shore A scale hardness of approximately 45, elongation of about 100%
Good damping qualities - low transmission of vibration and shock
Good environmental protection - low water absorption less than 0.10% after 7 days immersion at 25 °C (77 °F), high resistance to radiation (usable after exposure to 200 megarads)
Low shrinkage during cure - does not exert pressure on encapsulated or embedded components
Applications
For Modules, Power Supplies, Cable Connectors or Complete Electronic Assemblies, Electronic Components, Circuit Boards and Solar Cell Adhesive