Dow 93-500 Thixotropic Space Grade Encapsulant, 0.5kg Kit, MFR ID 93-500X.5KG
- MFR #93-500
- EIS #DC93-500X.5KG
- Series #93-500
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Dow Corning 93-500 space grade encapsulate is a transparent, room-temperature-curing, solventless silicone material designed for potting, filling, embedding and encapsulating electronic and other equipment for use in the space environment. It is supplied as a nearly colorless, free flowing, low viscosity fluid. - Dow Corning 93-500 encapsulate sections of the encapsulant can be cut out for replacement of components, new encapsulant can be poured in place and cured to re-form a tight seal.
Features
- Transparency - embedded parts can be visually inspected
- Good physical and electrical stability-retain properties from -65 to 200 °C (-85 to 392 °F), over a wide range of frequency and humidity
- Good firmness and flexibility - shore A scale hardness of approximately 45, elongation of about 100%
- Good damping qualities - low transmission of vibration and shock
- Good environmental protection - low water absorption less than 0.10% after 7 days immersion at 25 °C (77 °F), high resistance to radiation (usable after exposure to 200 megarads)
- Low shrinkage during cure - does not exert pressure on encapsulated or embedded components
Applications
- For Modules, Power Supplies, Cable Connectors or Complete Electronic Assemblies, Electronic Components, Circuit Boards and Solar Cell Adhesive
General Information
| Item Name | Encapsulant Kit |
| Series | 93-500 |
General Features
| Type | Thixotropic, Space Grade |
| Shelf Life | 6 Months |
| Storage Temperature | Below 32 °C |
Design & Construction
| Cure Type | Room Temperature |
| Form | Liquid |
Performance Details
| Tensile Strength | 790 psi |
Chemical Properties
| Composition | Silicone Elastomer |
| Specific Gravity | 1.08 |
| Viscosity | 8000 cSt |
Electrical Properties
| Dielectric Strength | 570V/Mil |
Physical Properties
| Container Size | 0.5kg |
| Container Type | Kit |
| Elongation | 110% |
| Hardness | 46 Shore A |
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