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Potting Compounds & Encapsulants

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Displaying 1 - 21 of 84 products found
  • Insulcast 116FR Equal Ratio Potting/Casting Compound

    Multiple item options available
    Mfr ID: 116FR
    Insulcast 116 FR is a 1:1 ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio of the material makes it ideal for production line mixing as well as automatic dispensing.

     

  • 3M 8882 Re-Enterable High Gel Encapsulant, 2.9 oz Tube, Clear/Light Amber

    ID: 3M8882X82G
    Mfr ID: 8882X82G
    3M high gel re-enterable encapsulant 8882 is a two-part non-urethane encapsulating compound. The encapsulant aggressively adheres to filled cable and is compatible with common plastics used in telephone splice connectors.

    In Stock

  • Elantas Electrical Insulation E-023FR Elan-Cast® Two-Part Potting Compound, 47 lb Pail, Black

    ID: E023FR47LB
    Mfr ID: E 023FR47LB
    Elan-Cast resins are used for potting or casting of low voltage transformers. It is a two-component, highly filled, semi-rigid epoxy resin system and offer the superior environmental protection of an epoxy.

    In Stock

  • Von Roll 277 Permafil® Thixotropic Masking Agent

    Multiple item options available
    Mfr ID: VRI-277
    Permafil 277 is a unique thixotropic masking agent formulated using duPont krytox. It is used for coating horizontal and vertical surfaces before treatment to aid in the easy removal of a wide variety of cured insulating resins including solventless epoxies and polyesters.

     

  • Cytec Industries EN-1556 Conathane® Conap® Encapsulant, 1 gal Kit, Amber/Black

    ID: CONEN1556BLKG
    Mfr ID: EN1556BLKG
    Conathane EN-1556 is a polyether based, non-MBOCA polyurethane resin system primarily intended for use as a molding, encapsulating and potting compound for harness breakouts, watertight electrical connectors, cables, cable end seals, printed circuitry and other electrical components. ConathaneEN-1556, when fully cured, is a tough, cold-flow resistant elastomer that has good resistance to oils, gasoline, JP-4 fuel, water and sea water and also provides outstanding protection against corrosion or contamination.

     

  • Star Technology ZS-119-1 Potting Compound

    Multiple item options available
    Mfr ID: ZS-119-1
    Star Technology ZS-119-1 Potting Compound.

    In Stock

  • Insulcast 504 Casting Epoxy, 9 lb/1 gal, Black

    ID: INS504BLKG
    Mfr ID: 504
    Insulcast 504 is an unfilled 100% solids epoxy resin casting or impregnating material. The product has excellent physical and electrical properties. The standard room temperature curing agent is INSULCURE 8 which gives fast cures and resilient castings.

     

  • Insulcast RTVS 61M Low Viscosity Potting Compound

    Multiple item options available
    Mfr ID: RTVS 61M
    RTVS 61M is a low viscosity, self-extinguishing transparent RTVS Silicone. RTVS 61M is used in situations where component identification and protection against shock and vibration is needed. Heat can be used to accelerate the cure.

     

  • Insulcast 333 Part A Self-Extinguishing Potting/Casting Compound

    Multiple item options available
    Mfr ID: 333
    Insulcast 333 is a moderate viscosity, self-extinguishing, epoxy potting/casting compound which conforms to the component program of Underwriters Laboratories' Flame Class 94V-O.

     

  • Dow Corning 7 Release Compound, 150g Tub, White/Translucent

    ID: DC7X150G
    Mfr ID: 7X150G
    Dow Corning 7 release compound is a versatile, heat stable, highly effective silicone release agent. Used with plastics, rubber, metals and adhesives, it gives long-lasting release, yet remains inert to most materials.

     

  • Dow Corning 3-8264 Elastomeric Encapsulant

    Multiple item options available
    Mfr ID: 8264
    Dow Corning encapsulant is a low viscosity and Self-priming at moderate temperatures.

     

  • Dow Corning 93-500 Thixotropic Space Grade Encapsulant

    Multiple item options available
    Mfr ID: 93-500
    Dow Corning 93-500 space grade encapsulate is a transparent, room-temperature-curing, solventless silicone material designed for potting, filling, embedding and encapsulating electronic and other equipment for use in the space environment. It is supplied as a nearly colorless, free flowing, low viscosity fluid.

     

  • Elantas Electrical Insulation C321 Elan-Cast® Two-Part Hardener Potting Compound, 1 qt

    ID: EPOC321Q
    Mfr ID: C321Q
    Elan-Cast C321 is a filled, room temperature cured, two-component epoxy system. It has excellent chemical and moisture resistance and high thermal conductivity.

     

  • 3M DP270 Scotch-Weld™ Potting Compound

    Multiple item options available
    Mfr ID: DP270
    3M Scotch-Weld epoxy potting compound/adhesive DP270 (or 3M Scotch-Weld epoxy potting compound/adhesive 270 B/A) is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting compound/adhesive DP270 is noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions.

     

  • Elantas Electrical Insulation E-4106 Elan-Tron® Potting Compound, 1 gal, Black

    ID: EPO4106G
    Mfr ID: E 4106G
    Elan-Tron potting compound is a two-component, general-purpose, flexible, filled polyurethane resin system. It has excellent thermal shock characteristics and polyurethane resins cure at room temperature and provide low temperature flexibility.

     

  • Elantas Electrical Insulation E-4141 Rigid Potting Compound, 1 qt Kit, White

    ID: EPO4141-15Q
    Mfr ID: E 4141-15Q
    Elantas Electrical Insulation E-4141 Rigid Potting Compound.

     

  • Elantas E-8112 Epoxylite® Two-Part High Temperature Potting Compound

    Multiple item options available
    Mfr ID: E-8112
    Epoxylite E 8112 hi-temp epoxy is a heat-cured, two-component system consisting of a viscous liquid resin and a finely divided powder hardener. It is provided in pre-measured kits. Epoxylite resins are used in overcoating and impregnation of armatures, stators and coils in motors and generators.

     

  • Elantas E-813-9 Epoxylite® High Temperature Potting Compound

    Multiple item options available
    Mfr ID: E-813-9
    Epoxylite E 813-9 hi-temp epoxy is a heat-cured, two-component system consisting of a viscous liquid resin and a finely divided powder hardener. It is provided in pre-measured kits. Maintains excellent electrical and physical properties to at least 260 deg C / 500 deg F. Chemical and moisture resistant. Potting and sealing of electrical and electronic components requiring resistance to high temperatures.

     

  • Elantas E-8628 Potting Compound

    Multiple item options available
    Mfr ID: E-8628
    Epoxylite hi-temp epoxies are two-component, heat-cured, 100% solids systems. They are supplied in kits containing the appropriate weight of Resin and Hardener. The Resin component is typically a viscous liquid or paste. The Hardener is a finely divided powder. All of the Hi-temp Epoxies are solventless.

     

  • Cytec Industries EN-12 Conathane® Conap® Part B Molding and Encapsulating System, 1 gal, Translucent Amber

    ID: CONEN12BG
    Mfr ID: EN12BG
    Conathane EN-11 and EN-12 are two-component, highly flexible liquid polyurethane molding and encapsulating systems that ensure the performance of electrical/electronic assemblies exposed to severe environmental extremes. Elastomers prepared from these systems exhibit the outstanding properties. These systems have also shown exceptional adhesion to a wide variety of substrates.

     

  • Cytec Industries EN-21 Conathane® Conap® Encapsulant, 5 gal Kit, Clear Amber

    ID: CONEN215GK
    Mfr ID: EN215GK
    Conathane EN-21 is an easy-to-use, UL 94 HB certified, two-component, low viscosity polyurethane resin system. This system was formulated specifically for the potting, casting, embedding and encapsulation of electronic circuits, components and power devices. Other outstanding properties of this system include low stress build-up on embedded components, reversion resistance and excellent moisture resistance.

     

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