Potting Compounds & Encapsulants
Potting Compounds & Encapsulants are a crucial part of many different electronic applications. Potting or Encapsulant Compounds are liquid compound-based resin systems that are poured over electric components. These liquid compounds are utilized in many different applications including insulation, moisture resistance, shock or vibration resistance, and much more. Potting Compounds & Encapsulants help to extend the lifespan of electronics by ensuring durability and reliability over time.
- Potting: The potting method employs a case or shell in which to put the device while pouring the liquid compound, covering the device completely. This is the most common method, popular for the quickness of it.
- Encapsulants: The encapsulation method, sometimes referred to as dip coating, requires the device be dipped wholly into the liquid compound.
Potting compounds and encapsulants are utilized on printed circuit boards when protection from extreme environmental, mechanical and physical elements are necessary.
Elantas Electrical Insulation E-GRC69 Elan-Tron® Two-Part Thixotropic Potting Compound, 0.959 lb Kit
Cytec Industries EN-12 Conathane® Conap® Part B Molding and Encapsulating System, 1 gal, Translucent Amber
Insulcast RTVS 8127 Part B Low Viscosity High Thermal Conductivity Potting Compound, 5 gal, Neutral/Nearly Colorless