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The Kester 958 is a no-clean, non-corrosive liquid flux that is specifically designed for the wave soldering of conventional and surface mount circuit board assemblies. 958 was developed to give excellent soldering performance on bare copper printed circuit boards treated with OSP coatings. Essentially, no residue remains after soldering. A major advantage of this flux is the reduced odor associated with the soldering process. - Boards are dry and cosmetically clean as they exit the wave solder machine, thus posing no interference with electrical testing. 958 has excellent compatibility with most conformal coating products on the market today. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue.
Features
- Excellent for bare copper circuit board technology
- Compatible with conformal coat processes
- Improves soldering performance
- Reduced odor associated with soldering process
- Eliminates the need and expense of cleaning
- Non-corrosive tack-free residues
- Temperature rating of 90 to 105 °C
- Vapor pressure of 43 hPa at 20 °C
General Information
| Item Name | Soldering Flux |
| Series | 958 |
General Features
| Shelf Life | 36 Months |
| Storage Temperature | 10 to 25 °C |
Design & Construction
| Color | Clear |
| Flux Type | No-Clean |
| Form | Liquid |
Performance Details
| Vapor Pressure | 43 hPa |
Chemical Properties
| Chemical Composition | Isopropanol, Bis(2-Butoxyethyl) Ether, Proprietary Carboxylic Acid, Aliphatic Ketone, Water |
| Flux Formula | 958 |
| Specific Gravity | 0.806 |
Physical Properties
| Odor/Scent | Mild |
Supporting Information
| Flux Designator | ORL0 |
| RoHS Info | 2015/863 Directive |
Documents
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