Kester R562 Type 3 Solder Paste, Sn63 Pb37, Silver Gray, 600g Cartridge, MFR ID 7021030511
- MFR #:70-2103-0511
- EIS #:SN63R562-600G89.5
- Series #:R562-6337-89.5
- MFR #:70-2103-0511
- EIS #:SN63R562-600G89.5
- Series #:R562-6337-89.5
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The Kester R562 is an organic acid, water soluble solder paste specifically designed for resistance to environmental extremes. Water soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. - R562 will maintain its print characteristics, tack and activity even after exposure to environmental extremes. Residues easily removed with hot DI water, even up to 96 hr after processing.
$133.88 / Piece
Min Qty:1
|Qty Increment:1
The Kester R562 is an organic acid, water soluble solder paste specifically designed for resistance to environmental extremes. Water soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. - R562 will maintain its print characteristics, tack and activity even after exposure to environmental extremes. Residues easily removed with hot DI water, even up to 96 hr after processing.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameSolder Paste
Trade NameKester
SeriesR562
General Features
Shelf Life6 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorSilver Gray
Flux TypeWater Soluble
FormPaste
Particle TypeType 3
Technical Details
Storage Media32 to 50
Chemical Properties
Flux FormulaR562
Lead FreeNo
Mesh Size-325/+500
Physical Properties
AlloySn63Pb37
Container Size600 g
Container TypeCartridge
Odor/ScentMild
Environmental Condition
Melting Range179 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorORM0
RoHS Info2011/65/EU Directive
Features
- stencil life of 12 hr
- Bright, shiny joints
- Capable of multiple reflow profiles before a cleaning operation is required
- Contains halogen
- Compatible with enclosed print head systems
- Consistent printing over a range of temperatures and humidities
- Excellent solderability to a wide variety of metallizations, including palladium
- Print speed up to 150 mm/sec (6 Inch/sec)
- Reduces BGA voiding to <3%
- Metals percentage of 89.5%
- Melting range of 179 to 189 °C
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications