Kester R562-6337-90 Type 3 Solder Paste
- MFR #R562-6337-90
- EIS #PH19-R562-6337-90
- Series #R562-6337-90
$114.07 - $133.88
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The Kester R562 is an organic acid, water soluble solder paste specifically designed for resistance to environmental extremes. Water soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. - R562 will maintain its print characteristics, tack and activity even after exposure to environmental extremes. Residues easily removed with hot DI water, even up to 96 hr after processing.
Features
- stencil life of 12 hr
- Bright, shiny joints
- Capable of multiple reflow profiles before a cleaning operation is required
- Contains halogen
- Compatible with enclosed print head systems
- Consistent printing over a range of temperatures and humidities
- Excellent solderability to a wide variety of metallizations, including palladium
- Print speed up to 150 mm/sec (6 Inch/sec)
- Reduces BGA voiding to <3%
- Metals percentage of 90%
- Melting range of 179 to 189 °C
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications
General Information
| Item Name | Solder Paste |
| Series | R562-6337-90 |
General Features
| Shelf Life | 6 Months |
| Storage Temperature | 0 to 10 °C |
Design & Construction
| Color | Silver Gray |
| Flux Type | Organic Activated or Water Soluble |
| Form | Paste |
| Particle Type | Type 3 |
Chemical Properties
| Flux Formula | R562 |
Physical Properties
| Alloy | Sn63 Pb37 |
| Odor/Scent | Mild |
Environmental Condition
| Melting Range | 179 °C |
Supporting Information
| Applicable Materials | Stainless Steel, Molybdenum, Nickel Plated or Brass |
| Flux Designator | ORH0 |
| RoHS Info | 2011/65/EU Directive |
Documentos
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