Kester NP560 No Clean Lead Free SAC305 Solder Paste, MFR ID NP560-SAC305
- MFR #NP560-SAC305
- EIS #PH19-NP560-SAC305
- Series #NP560-SAC305
$264.88
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| Stock Status | |||||
|---|---|---|---|---|---|
 | 500 g | Jar | Type 4 | $ / Piece |
Kester NP560 is a no-clean, lead-free, halogen-free solder paste with low voiding performance. - Kester NP560 consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
Features
- Classified as ROL0 per J-STD-004B
- Halogen-Free
- Low voiding potential under QFNs
- Excellent activity and printability
- Very low graping
- Reflowable in air and nitrogen conditions
- Wide reflow profile window with good solderability on various PCB surface finish
General Information
| Item Name | Solder Paste |
| Series | NP560-SAC305 |
Design & Construction
| Particle Type | Type 4 |
Chemical Properties
| Flux Formula | NP560 |
| Lead Free | Yes |
| Mesh Size | -400/+500 |
Physical Properties
| Alloy | Sn96.5 Ag3.0 Cu0.5 (SAC305) |
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