The Kester FL250D is a no-clean, air or nitrogen reflowable solder paste specifically designed for automotive requirements. FL250D is compatible with post-soldering process chemicals, including conformal coatings and potting compounds. - FL250D is capable of stencil printing downtimes of up to 90 min with an effective first print at 20 mils. FL250D also has the capability of printing up to 8 in/sec (200 mm/sec) with squeegees or within an enclosed head.
$155.69
- $161.21
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The Kester FL250D is a no-clean, air or nitrogen reflowable solder paste specifically designed for automotive requirements. FL250D is compatible with post-soldering process chemicals, including conformal coatings and potting compounds. - FL250D is capable of stencil printing downtimes of up to 90 min with an effective first print at 20 mils. FL250D also has the capability of printing up to 8 in/sec (200 mm/sec) with squeegees or within an enclosed head.
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Container Size:
600 g
Container Type:
Cartridge
EIS Part #:
SN63FL250D-600G
$ / Cartridge
Container Size:
500 g
Container Type:
Jar
EIS Part #:
SN63FL250D-500G
$ / Piece
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Attributes
Features
Applications
Attributes
General Information
Item NameSolder Paste
SeriesFL250D-6337-90
General Features
Shelf Life4 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorSilver Gray
Flux TypeNo-Clean
FormPaste
Particle TypeType 3
Chemical Properties
Flux FormulaFL250D
Mesh Size-325/+500
Physical Properties
AlloySn63 Pb37
Odor/ScentMild
Environmental Condition
Melting Range100 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorROL0
RoHS Info2011/65/EU Directive
Features
Capable of 90 min break times in printing
Contains halogen
Compatible with 0201 technology
Compatible with DEK ProFlow and MPM RheoPump enclosed print head systems
Excellent printing characteristics to 0.4 mm (16 Mil) pitch with type 3 powder
Excellent residue characteristics that are completely compatible with conformal coating and potting processes
Excellent wetting on a variety of substrates, including OSP