AIM Solder 84351 Solder Bar, Lead-Free, REL61TM, 2.5 lb
- MFR #84351
- EIS #84351-AIM
$63.31 / US pound
Agotado
Cantidad mínima1QTY Increment1
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AIM’s REL61TM is comprised of tin, bismuth, silver, copper micro-element grain structure refiners. REL61 provides the electronics assembly marketplace a low-cost alternative to SAC alloys that has reliability and performance characteristics equal to SAC305 and greater than other low/no-silver solder alloys. REL61 has shown to reduce tin whisker formation as well as outperforming low/no-silver alloys in thermal shock, vibration and drop shock resistance. Lower reflow and solder pot temperature can be used with REL61 versus other low/no silver alloys.
Features
- Reduces Tin Whisker Formation
- Lower Reflow/Solder Pot Temperature
- Low-Cost SAC Alloy
- Improved Wetting Versus All Low/No-Silver Alloys
- For use in Lead-Free Process Only
- Complies with IPC J-STD-006
Applications
- Ideal for automotive, telecom and consumer assemblies
- Smooth uniform appearance in SMT soldering
- Lower reflow/solder pot temperature
- Reduces solder dross in selective and wave soldering applications
- For use in lead-free process only
General Information
| Item Name | Solder Bar |
| Trade Name | AIM Solder |
General Features
| Standards | Complies with IPC J-STD-006 |
| Net Weight | 2.5 lb |
| Shelf Life | 7 years |
| Storage Temperature | Room Temperature |
Design & Construction
| Form | 100% Solid |
Chemical Properties
| Lead Free | Yes |
Physical Properties
| Container Size | 2.5 lb |
| Weight | 2.5 lb |
Environmental Condition
| Melting Range | 208-215 C |
Supporting Information
| RoHS Info | Yes, RoHS Compliant |