MFR #:1239
EIS #:1239-AIM
MFR #:1239
EIS #:1239-AIM
Out of Stock
Min Qty:1
|Qty Increment:1
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.
Requires Quote / US pound
Min Qty:1
|Qty Increment:1
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSolder Bar
Trade NameAIM Solder
SeriesSAC305
General Features
StandardsREACH compliant, RoHS compliant, JEIDA compliant
Net Weight1.66 lb
Shelf LifeIndefinite
Storage TemperatureRoom Temperature
Design & Construction
Form100% Solid
Chemical Properties
Lead FreeYes
Physical Properties
Container Size1.66 LB
Weight1.66 lb
Environmental Condition
Melting RangeSolidus: 217 C (423 F), Liquidus: 220 C (428 F)
Supporting Information
RoHS InfoYes, RoHS Compliant
Features
- Liquidus 220 C (428 F)
- Compatible with all Flux Types
- Excellent Wetting Speed
- Excellent Solderability and Spreading
- Reduced Bridging Versus Sn-Cu Alloys
- Manufactured with AIM Electropure Technology
Applications
- AIM’s Electropure technology reduces solder drossing, improves flow and reduces bridging
- IPC/JEIDA/IEC/EIN recommended alloy for lead-free soldering
- Suitable for a wide variety of applications
- Popular in consumer and automotive applications