The Kester EM907 is a lead-free, air and nitrogen reflow able, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys. This solder paste also exceeds the reliability standards required by J-STD-004. - EM907 is capable of stencil printing downtimes up to 60 min with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).
$164.93
- $316.68
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The Kester EM907 is a lead-free, air and nitrogen reflow able, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys. This solder paste also exceeds the reliability standards required by J-STD-004. - EM907 is capable of stencil printing downtimes up to 60 min with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).
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Container Size:
750g
Container Type:
Cartridge
Particle Type:
Type 3
EIS Part #:
SN965AG3EM907-750G
$ / Piece
Container Size:
600 g
Container Type:
Cartridge
Particle Type:
Type 3
EIS Part #:
SN965AG3EM907-600G
$ / Piece
Container Size:
500 g
Container Type:
Jar
Particle Type:
Type 3
EIS Part #:
SN965AG3EM907-500G
$ / Piece
Container Size:
600 g
Container Type:
Cartridge
Particle Type:
Type 4
EIS Part #:
SN96.5EM907-600GT4
$ / Piece
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Attributes
Features
Applications
Documents
Attributes
General Information
Item NameLead-Free Solder Paste
SeriesEM907-SAC305-88.5
General Features
TypeLead-Free
Shelf Life4 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorSilver Gray
Flux TypeNo-Clean
FormPaste
Chemical Properties
Flux FormulaEM907
Mesh Size-325/+500
Physical Properties
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Odor/ScentMild
Environmental Condition
Melting Range235 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorROL0
RoHS Info2011/65/EU Directive
Features
Capable of 60 min break times in printing
Contains halogen
Excellent print and reflow characteristics for 0201 applications
Excellent printing characteristics to 16 and 20 Mils pitch
Excellent solderability to a wide variety of surface metallizations, including Ni/Au, LM Sn and Im Ag
High print speeds up to 150 mm/sec
Lead-free joints that closely resemble those achieved with Sn-Pb solder paste