MFR #:CWR
EIS #:PH19-CWR
Series #:CWR
MFR #:CWR
EIS #:PH19-CWR
Series #:CWR
Chem-Wik rosin is especially designed for today's heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. - Chem-Wik rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less "contact" pressure for greater operator control. All sizes are coated with a Type "R" organic flux system.
$5.37
- $474.51
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Chem-Wik rosin is especially designed for today's heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. - Chem-Wik rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less "contact" pressure for greater operator control. All sizes are coated with a Type "R" organic flux system.
Product Options
Showing 5 out of 5 options
Length: 50 ft | Width: 0.075 Inch | EIS Part #: CHE7-50L | $ / each Pack: 1 Spool/Case | ||
Length: 25 ft | Width: 0.075 Inch | EIS Part #: CHE7-25L | $ / Spool Pack: 1 Spool/Case | ||
Length: 100 ft | Width: 0.075 Inch | EIS Part #: CHE7-100L | $ / each Pack: 1 Spool/Case | ||
Length: 25 ft | Width: 0.05 Inch | EIS Part #: CHE5-25L | $ / each Pack: 1 Spool/Case | ||
Length: 500 ft | Width: 0.1 Inch | EIS Part #: 10-500L | $ / Roll Pack: 1 Spool/Case |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameDesoldering Braid
Trade NameChem-Wik®
SeriesCWR
General Features
Shelf Life24 Months
Design & Construction
Flux TypeRosin Activated
MaterialCopper
Features
- Requires little or no post solder cleaning, non-corrosive residues
- Optimized weave design for faster wicking and heat transfer
- Halide free
- Coated with ultra high purity, non-corrosive type R rosin flux
- Quickly and thoroughly removes solder
- Fast wicking action protects components from harmful heat damage
Applications
- For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script