MG Chemicals 860-3.78L Silicone Heat Transfer Compound, 3.78 L
- MFR #860-3.78L
- EIS #860-3.78L
$623.93 / Pail
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860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
Features
- High thermal conductivity (0.7 W/m·K)
- High dielectric strength
- Non-electrically conductive
- Excellent corrosion resistance
- Non-bleeding
Applications
- Thermal management
- Heat dissipation for CPUs, GPUs, LEDs
General Information
| Item Name | Heat Transfer Compound |
| Trade Name | MG Chemicals |
| Series | 860 |
General Features
| Net Weight | 9.07 kg |
Design & Construction
| Color | White |
| Form | Paste |
Performance Details
| Adhesive Strength | Medium |
| Heat Resistance | Yes |
Physical Properties
| Container Type | Pail |
Supporting Information
| Use With | CPUs, GPUs, LEDs, Motors |