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Kester TSF-6852 Organic Activated Soldering Flux, 30g Syringe, Opaque, MFR ID 300203

The image shown is representative of the product family and may not specifically be the individual item.  The Kester TSF-6852 is a synthetic water soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typic…
  • MFR #:300203
  • EIS #:TSF-6852-30G
  • Series #:TSF-6852
  • MFR #:300203
  • EIS #:TSF-6852-30G
  • Series #:TSF-6852
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The Kester TSF-6852 is a synthetic water soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typically found in fluxes. This maximizes lot-to-lot consistency. TSF-6852 is room temperature stable and does not require refrigeration for long-term storage. This reduces production line space for material storage and the cost of refrigerated storage. TSF-6852 has been formulated to be a drop in replacement for a variety of metallurgies. - These include low melting point alloys (SnBi, SnBiAg, etc.), typical tin-lead eutectic alloys and the higher melting point, lead-free alloys (SnAg, SnCu, SnAgCu, SnSb, etc.). Post reflow, the residues are completely soluble in water and do not require any cleaning additives. To reduce the cost of assembling, room temperature or cool water (<65 °C) can be used to remove TSF-6852 residues.
$74.74 / Piece

Min Qty:1

  |  

Qty Increment:1

This product requires overnight transport (Mon-Thurs).
more info
Temperature sensitive products require cold pack during shipping.
more info
0
0
The Kester TSF-6852 is a synthetic water soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typically found in fluxes. This maximizes lot-to-lot consistency. TSF-6852 is room temperature stable and does not require refrigeration for long-term storage. This reduces production line space for material storage and the cost of refrigerated storage. TSF-6852 has been formulated to be a drop in replacement for a variety of metallurgies. - These include low melting point alloys (SnBi, SnBiAg, etc.), typical tin-lead eutectic alloys and the higher melting point, lead-free alloys (SnAg, SnCu, SnAgCu, SnSb, etc.). Post reflow, the residues are completely soluble in water and do not require any cleaning additives. To reduce the cost of assembling, room temperature or cool water (<65 °C) can be used to remove TSF-6852 residues.

Attributes

General Information

Item NameSoldering Flux

SeriesTSF-6852

General Features

Shelf Life4 Months
Storage Temperature0 to 10 °C

Design & Construction

ColorOpaque
Flux TypeOrganic Activated or Water Soluble
FormViscous Liquid

Chemical Properties

Chemical Composition2-Propanol, 1-(2-Butoxy-1-Methylethoxy), Non-Hazardous Material, Proprietary Solvent, Water
Flux FormulaTSF-6852

Physical Properties

Container Size30g
Container TypeSyringe
Odor/ScentMild

Supporting Information

Flux DesignatorORH1
RoHS Info2011/65/EU Directive