Kester TSF-6592LV No-Clean Soldering Flux, 30g Syringe, Yellow, MFR ID 300303
- MFR #300303
- EIS #TSF-6592LV-30G
- Series #TSF-6592LV
$74.74 / Piece
In Stock | Ready to Ship
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The Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. - Compatible with lead-free alloys such as SnAg, SnCu, SnAgCu, SnAgBi. Reflow able with peak temperatures up to 270 °C. Reflow able in air and nitrogen. Bright shiny soldered joints with clear residues.
Features
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- Clear non-tacky residues
- Low voiding behavior
- High tack to minimize skewing of components
General Information
| Item Name | Soldering Flux |
| Series | TSF-6592LV |
General Features
| Shelf Life | 4 Months |
| Storage Temperature | 0 to 10 °C |
Design & Construction
| Color | Yellow |
| Flux Type | No-Clean |
| Form | Viscous Liquid |
Chemical Properties
| Chemical Composition | Rosin, Aromatic Alcohols, Hydrogenated Castor Oil, Proprietary Organic Acids |
| Flux Formula | TSF-6592LV |
Physical Properties
| Container Size | 30g |
| Container Type | Syringe |
| Odor/Scent | Mild |
Supporting Information
| Flux Designator | ROL0 |
| RoHS Info | 2015/863 Directive |
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