MFR #:300303
EIS #:TSF-6592LV-30G
Series #:TSF-6592LV
MFR #:300303
EIS #:TSF-6592LV-30G
Series #:TSF-6592LV
In Stock
Min Qty:1
|Qty Increment:1
The Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. - Compatible with lead-free alloys such as SnAg, SnCu, SnAgCu, SnAgBi. Reflow able with peak temperatures up to 270 °C. Reflow able in air and nitrogen. Bright shiny soldered joints with clear residues.
$70.70 / Piece
Min Qty:1
|Qty Increment:1
The Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. - Compatible with lead-free alloys such as SnAg, SnCu, SnAgCu, SnAgBi. Reflow able with peak temperatures up to 270 °C. Reflow able in air and nitrogen. Bright shiny soldered joints with clear residues.
- Attributes
- Features
Attributes
General Information
Item NameSoldering Flux
SeriesTSF-6592LV
General Features
Shelf Life4 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorYellow
Flux TypeNo-Clean
FormViscous Liquid
Chemical Properties
Chemical CompositionRosin, Aromatic Alcohols, Hydrogenated Castor Oil, Proprietary Organic Acids
Flux FormulaTSF-6592LV
Physical Properties
Container Size30g
Container TypeSyringe
Odor/ScentMild
Supporting Information
Flux DesignatorROL0
RoHS Info2015/863 Directive
Features
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- Clear non-tacky residues
- Low voiding behavior
- High tack to minimize skewing of components