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Kester TSF-6592LV No-Clean Soldering Flux, 30g Syringe, Yellow

The image shown is representative of the product family and may not specifically be the individual item.  The Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip c…

MFR #:300303

EIS #:TSF-6592LV-30G

Series #:TSF-6592LV

MFR #:300303

EIS #:TSF-6592LV-30G

Series #:TSF-6592LV

In Stock

Min Qty:1

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Qty Increment:1

This product requires overnight transport (Mon-Fri).
Temperature sensitive products require cold pack during shipping.
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The Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. - Compatible with lead-free alloys such as SnAg, SnCu, SnAgCu, SnAgBi. Reflow able with peak temperatures up to 270 °C. Reflow able in air and nitrogen. Bright shiny soldered joints with clear residues.
$40.85 / Piece

Buy In Bulk & Save

1-4$40.85 / 1 Piece
5-9$39.94 / 1 Piece
10-19$39.04 / 1 Piece
20+$38.12 / 1 Piece

Buy In Bulk & Save

1-4$40.85 / 1 Piece
5-9$39.94 / 1 Piece
10-19$39.04 / 1 Piece
20+$38.12 / 1 Piece

Min Qty:1

  |  

Qty Increment:1

This product requires overnight transport (Mon-Fri).
Temperature sensitive products require cold pack during shipping.
0
0
The Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. - Compatible with lead-free alloys such as SnAg, SnCu, SnAgCu, SnAgBi. Reflow able with peak temperatures up to 270 °C. Reflow able in air and nitrogen. Bright shiny soldered joints with clear residues.

Attributes

General Information
Item NameSoldering Flux
SeriesTSF-6592LV
General Features
Shelf Life4 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorYellow
Flux TypeNo-Clean
FormViscous Liquid
Chemical Properties
Chemical CompositionRosin, Aromatic Alcohols, Hydrogenated Castor Oil, Proprietary Organic Acids
Flux FormulaTSF-6592LV
Physical Properties
Container Size30g
Container TypeSyringe
Odor/ScentMild
Supporting Information
Flux DesignatorROL0
RoHS Info2015/863 Directive