Kester 959 No-Clean Soldering Flux
- MFR #959
- EIS #PH19-959
- Series #959
$103.43 - $108.73
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Pack--| Stock Status | |||
|---|---|---|---|
 | 5 gal | $ / US gallon more info | |
 | 53 gal | $ / US gallon more info | |
 | 1 gal | $ / US gallon |
The Kester 959 is a no-clean, non-corrosive liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. 959 was developed to minimize the formation of micro-solder balls during wave soldering operations. 959 leaves evenly distributed residues for the best cosmetic appearance. - This flux contains a small percentage of rosin (1%), which improves solderability, heat stability and surface insulation resistance. 959 offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry.
Features
- Minimize micro solderballs
- Extremely shiny joints
- No streaky, white residues
- Improves soldering performance
- Eliminates the need and expense of cleaning
- Temperature rating of 90 to 105 °C
- Vapor pressure of 43 hPa at 20 °C
General Information
| Item Name | Soldering Flux |
| Series | 959 |
General Features
| Shelf Life | 36 Months |
| Storage Temperature | 10 to 25 °C |
Design & Construction
| Color | Light Yellow |
| Flux Type | No-Clean |
| Form | Liquid |
Performance Details
| Vapor Pressure | 43 hPa |
Chemical Properties
| Chemical Composition | Isopropanol, Terpene Alcohol, Aliphatic Carboxylic Acid, Rosin |
| Flux Formula | 959 |
| Specific Gravity | 0.81 |
| VOC | 746 g/L |
Physical Properties
| Odor/Scent | Alcohol |
Supporting Information
| Flux Designator | ORL0 |
| RoHS Info | 2011/65/EU Directive |
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