MFR #:2235
EIS #:PH19-2235
Series #:2235
MFR #:2235
EIS #:PH19-2235
Series #:2235
The Kester 2235 is a high activity 11% solids organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. 2235, a flux with comparably low solids in respect to other fluxes in the same category, will produce fewer skips on the bottom side surface mount pads. - The residue after soldering is effectively removed in standard water cleaning systems. Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809. No offensive odors or excessive smoke are emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.
$104.79
- $118.52
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The Kester 2235 is a high activity 11% solids organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. 2235, a flux with comparably low solids in respect to other fluxes in the same category, will produce fewer skips on the bottom side surface mount pads. - The residue after soldering is effectively removed in standard water cleaning systems. Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809. No offensive odors or excessive smoke are emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.
Product Options
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Container Size: 1 gal | EIS Part #: KES2235G | $ / US gallon | ||
Container Size: 5 gal | EIS Part #: KES22355G | $ / US gallon | ||
Container Size: 53 gal | EIS Part #: KES223553G | $ / US gallon |
- Attributes
- Features
Attributes
General Information
Item NameSoldering Flux
Series2235
General Features
Shelf Life24 Months
Storage Temperature10 to 25 °C
Design & Construction
ColorLight Yellow
FormLiquid
Flux TypeOrganic Activated or Water Soluble
Performance Details
Vapor Pressure43 hPa
Chemical Properties
Chemical CompositionIsopropanol, Glycolic Acid, Guanidinium Chloride, Glycerol, Water
Flux Formula2235
Specific Gravity0.856
VOC763 g/L
Physical Properties
Odor/ScentAlcohol
Supporting Information
Flux DesignatorORH1
RoHS Info2011/65/EU Directive
Features
- High activity
- Minimizes icicling and bridging
- Chemically compatible with most solder masks and board laminates
- High ionic cleanliness and no surface insulation resistance degradation
- Excellent choice for surface mount boards
- Temperature rating of 54 to 66 °C
- Vapor pressure of 43 hPa at 20 °C