The Kester 2224-25 is a high activity, organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. The flux will provide good capillary wetting action up plated through holes, making it suitable for multi-layer boards. The residue after soldering is effectively removed in standard water cleaning systems. - Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809A. No offensive odors or excessive smoke is emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.
$168.77
- $188.66
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The Kester 2224-25 is a high activity, organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. The flux will provide good capillary wetting action up plated through holes, making it suitable for multi-layer boards. The residue after soldering is effectively removed in standard water cleaning systems. - Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809A. No offensive odors or excessive smoke is emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.
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Container Size:
1 gal
EIS Part #:
KES222425G
$ / each
Container Size:
5 gal
EIS Part #:
KES2224255G
$ / US gallon
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Attributes
Features
Attributes
General Information
Item NameSoldering Flux
Series2224-25
General Features
Shelf Life24 Months
Storage Temperature10 to 25 °C
Design & Construction
ColorLight Yellow
Flux TypeOrganic Activated or Water Soluble
FormLiquid
Performance Details
Vapor Pressure43 hPa
Chemical Properties
Chemical CompositionIsopropanol, Glycolic Acid, Guanidinium Chloride, Glycerol, Water
Flux Formula2224-25
Specific Gravity0.882
Physical Properties
Odor/ScentMild
Supporting Information
Flux DesignatorORH1
RoHS Info2002/95/EC Directive
Features
High activity
Minimizes icicling and bridging
Chemically compatible with most solder masks and board laminates
High ionic cleanliness and no surface insulation resistance degradation