MFR #:70-1708-0520
EIS #:SN63R500-35G
Series #:R500-6337-86
MFR #:70-1708-0520
EIS #:SN63R500-35G
Series #:R500-6337-86
Out of Stock
Min Qty:1
|Qty Increment:1
The Kester R500 is a water soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting characteristics in a wide range of profiles. - The activator package in this formula is extremely aggressive. It is active enough to remove tenacious oxide layers or to solder to OSP coated boards. R500 is a water soluble formula that maintains its activity and tackiness characteristics for up to 8 hr.
$28.35 / each
Min Qty:1
|Qty Increment:1
The Kester R500 is a water soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting characteristics in a wide range of profiles. - The activator package in this formula is extremely aggressive. It is active enough to remove tenacious oxide layers or to solder to OSP coated boards. R500 is a water soluble formula that maintains its activity and tackiness characteristics for up to 8 hr.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSolder Paste
SeriesR500-6337-86
General Features
Shelf Life6 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorSilver Gray
Flux TypeOrganic Activated or Water Soluble
FormPaste
Particle TypeType 3
Chemical Properties
Flux FormulaR500
Mesh Size-325/+500
Physical Properties
AlloySn63 Pb37
Container Size35 g
Container TypeSyringe
Odor/ScentMild
Environmental Condition
Melting Range183 °C
Supporting Information
Flux DesignatorORM0
RoHS Info2011/65/EU Directive
Features
- Capable of dispensing rate of 4 dots per sec
- Contains halogen
- Excellent dispensing characteristics using 21 ga needles and Type 3 powder
- Leaves bright/shiny solder joints after reflow
- Packaged void-free
- Residues easily removed with hot DI water
- Scrap is reduced due to minimal paste clogging and separation
- Metals percentage of 86%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications