Kester WP616 Water Soluble, Lead-Free SAC305 Solder Paste, MFR ID WP616-SAC305
- MFR #WP616-SAC305
- EIS #PH19-WP616-SAC305
- Series #WP616-SAC305
$226.64 - $271.97
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 | 500 g | Jar | Type 4 | $ / Piece more info |
WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. It has a wide reflow profile window with good solderability. - WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition. WP616 is classified as ORM0 flux under IPC J-STD-004B.
Features
- Superior reflow characteristics
- Classified as ORM0 per J-STD-004B
- Excellent activity and printability
- Zero-Halogen (none intentionally added)
- Wide reflow profile window with good solderability
- Reflowable in air and nitrogen conditions
- Cleaning can be accomplished with heated de-ionized water
General Information
| Item Name | Solder Paste |
| Series | WP616-SAC305 |
Design & Construction
| Flux Type | Organic Activated or Water Soluble |
| Particle Type | Type 4 |
Chemical Properties
| Flux Formula | WP616 |
| Lead Free | Yes |
Physical Properties
| Alloy | Sn96.5 Ag3.0 Cu0.5 (SAC305) |
Supporting Information
| Flux Designator | ORM0 |
Documents
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