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The Kester R231 is a mildly activated rosin (RMA) solder paste formula specifically designed to exhibit long stencil/print life. R231 maintains its activity and printing characteristics for up to 8 hr (temperature and humidity dependent). - Capable of 90 min break times in printing. Compatible with 0201 technology. Contains halogen. Compatible with DEK ProFlow and MPM RheoPump enclosed print head systems.
Features
- Excellent printing characteristics to 0.4 mm (16 Mil) pitch with type 3 powder
- Excellent wetting on a variety of substrates, including OSP
- High print speeds to 200 mm/sec (8 Inch/sec)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hr
- Stencil life of 8+ hr (process dependent)
- Metals percentage of 90%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications
General Information
| Item Name | Solder Paste |
| Series | R231-6337-90 |
General Features
| Shelf Life | 4 Months |
| Storage Temperature | 0 to 10 °C |
Design & Construction
| Color | Silver Gray |
| Flux Type | Rosin Mildly Activated |
| Form | Paste |
| Particle Type | Type 3 |
Chemical Properties
| Flux Formula | R231 |
| Mesh Size | -325/+500 |
Physical Properties
| Alloy | Sn63 Pb37 |
| Odor/Scent | Mild |
Environmental Condition
| Melting Range | 100 °C |
Supporting Information
| Applicable Materials | Stainless Steel, Molybdenum, Nickel Plated or Brass |
| Flux Designator | ROL0 |
| RoHS Info | 2011/65/EU Directive |
Documents
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