MFR #:NP560-SAC305
EIS #:PH19-NP560-SAC305
Series #:NP560-SAC305
MFR #:NP560-SAC305
EIS #:PH19-NP560-SAC305
Series #:NP560-SAC305
Kester NP560 is a no-clean, lead-free, halogen-free solder paste with low voiding performance. - Kester NP560 consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
$157.47
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Kester NP560 is a no-clean, lead-free, halogen-free solder paste with low voiding performance. - Kester NP560 consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
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Container Size: 500 g | Container Type: Jar | Particle Type: Type 4 | EIS Part #: SN96.5NP560-500GT4 | $ / Piece |
- Attributes
- Features
Attributes
General Information
Item NameSolder Paste
SeriesNP560-SAC305
Design & Construction
Particle TypeType 4
Chemical Properties
Flux FormulaNP560
Lead FreeYes
Mesh Size-400/+500
Physical Properties
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Features
- Classified as ROL0 per J-STD-004B
- Halogen-Free
- Low voiding potential under QFNs
- Excellent activity and printability
- Very low graping
- Reflowable in air and nitrogen conditions
- Wide reflow profile window with good solderability on various PCB surface finish