Kester NP560 No Clean Lead Free SAC305 Solder Paste, MFR ID NP560-SAC305
MFR #:NP560-SAC305
EIS #:PH19-NP560-SAC305
Series #:NP560-SAC305
MFR #:NP560-SAC305
EIS #:PH19-NP560-SAC305
Series #:NP560-SAC305
Kester NP560 is a no-clean, lead-free, halogen-free solder paste with low voiding performance. - Kester NP560 consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
$182.01
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Kester NP560 is a no-clean, lead-free, halogen-free solder paste with low voiding performance. - Kester NP560 consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
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Container Size:
500 g
Container Type:
Jar
Particle Type:
Type 4
EIS Part #:
SN96.5NP560-500GT4
$ / Piece
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Attributes
Features
Attributes
General Information
Item NameSolder Paste
SeriesNP560-SAC305
Design & Construction
Particle TypeType 4
Chemical Properties
Flux FormulaNP560
Lead FreeYes
Mesh Size-400/+500
Physical Properties
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Features
Classified as ROL0 per J-STD-004B
Halogen-Free
Low voiding potential under QFNs
Excellent activity and printability
Very low graping
Reflowable in air and nitrogen conditions
Wide reflow profile window with good solderability on various PCB surface finish