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Pack--| Stock Status | |||||
|---|---|---|---|---|---|
| 600 g | Cartridge | Type 3 | $ / Cartridge | ||
| 500 g | Jar | Type 3 | $ / Piece more info |
EP256HA is a no-clean, air or nitrogen reflow able solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations. - EP256HA is also capable of stencil printing after downtimes of up to 90 min with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.
Features
- Contains halogen
- Capable of 90 min break times in printing
- Capable of off-pad printing with no solder balls after reflow
- Stable wetting behavior over a wide range of profiles
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4 mm (16 Mil) pitch with type 3 powder
- High activity on all substrates, including OSPs
- High print speeds to 200+ mm/sec (8+ Inch/sec)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hr
- Stencil life of 8+ hr (process dependent)
- Metals percentage of 90%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications
General Information
| Item Name | Solder Paste |
| Series | EP256HA-6337-90 |
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