Kester EP256HA-6337-90 Type 3 Solder Paste, MFR ID 7002020511
- MFR #:7002020511
- EIS #:PH19-EP256HA-6337-90
- Series #:EP256HA-6337-90
- MFR #:7002020511
- EIS #:PH19-EP256HA-6337-90
- Series #:EP256HA-6337-90
EP256HA is a no-clean, air or nitrogen reflow able solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations. - EP256HA is also capable of stencil printing after downtimes of up to 90 min with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.
$110.78
- $129.19
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EP256HA is a no-clean, air or nitrogen reflow able solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations. - EP256HA is also capable of stencil printing after downtimes of up to 90 min with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.
Product Options
Showing 2 out of 2 options
 | Container Size: 600 g | Container Type: Cartridge | Particle Type: Type 3 | EIS Part #: SN63EP256HA-600G | $ / Cartridge | |
| Container Size: 500 g | Container Type: Jar | Particle Type: Type 3 | EIS Part #: SN63EP256HA-500G | $ / Piece |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSolder Paste
SeriesEP256HA-6337-90
Features
- Contains halogen
- Capable of 90 min break times in printing
- Capable of off-pad printing with no solder balls after reflow
- Stable wetting behavior over a wide range of profiles
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4 mm (16 Mil) pitch with type 3 powder
- High activity on all substrates, including OSPs
- High print speeds to 200+ mm/sec (8+ Inch/sec)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hr
- Stencil life of 8+ hr (process dependent)
- Metals percentage of 90%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications