EP256HA is a no-clean, air or nitrogen reflow able solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations. - EP256HA is also capable of stencil printing after downtimes of up to 90 min with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.