$119.77 - $244.79
Refine your product below or compare all choices in the
Min QTY1QTY Increment1more infoPack--
| Stock Status | |||||
|---|---|---|---|---|---|
| 600 g | Cartridge | Type 4 | $ / Piece | ||
| 750g | Cartridge | Type 3 | $ / Piece | ||
| 600 g | Cartridge | Type 3 | $ / each |
EP256 is a no-clean, air or nitrogen reflow able solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. - EP256 is also capable of stencil printing downtimes of up to 90 min with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.
Features
- Contains halogen
- Capable of 90 min break times in printing
- Capable of off-pad printing with no solder balls after reflow
- Stable wetting behavior over a wide range of profiles
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4 mm (16 Mil) pitch with type 3 powder
- High activity on all substrates, including OSPs
- High print speeds to 200+ mm/sec (8+ Inch/sec)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hr
- Stencil life of 8+ hr (process dependent)
- Metals percentage of 90%
- Melting range of 179 to 189 °C
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications
General Information
| Item Name | Solder Paste |
| Series | EP256-6337-90 |
General Features
| Shelf Life | 6 Months |
| Storage Temperature | 0 to 10 °C |
Design & Construction
| Color | Silver Gray |
| Flux Type | No-Clean |
| Form | Paste |
Chemical Properties
| Flux Formula | EP256 |
Physical Properties
| Alloy | Sn63 Pb37 |
| Odor/Scent | Mild |
Environmental Condition
| Melting Range | 179 °C |
Supporting Information
| Applicable Materials | Stainless Steel, Molybdenum, Nickel Plated or Brass |
| Flux Designator | ROL0 |
| RoHS Info | 2011/65/EU Directive |
Documents
No Documents Found