EP256 is a no-clean, air or nitrogen reflow able solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. - EP256 is also capable of stencil printing downtimes of up to 90 min with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.