Kester Solder-PH19-EP256-6337-90;SN62EP256-500G;SN63EP256-500G-Product
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Kester EP256-6337-90 Solder Paste

  • MFR #EP256-6337-90
  • EIS #PH19-EP256-6337-90
  • Series #EP256-6337-90
$119.77 - $244.79
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EP256 is a no-clean, air or nitrogen reflow able solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. - EP256 is also capable of stencil printing downtimes of up to 90 min with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hr without any shear thinning.

General Information

Item NameSolder Paste

SeriesEP256-6337-90

General Features

Shelf Life6 Months
Storage Temperature0 to 10 °C

Design & Construction

ColorSilver Gray
Flux TypeNo-Clean
FormPaste

Chemical Properties

Flux FormulaEP256

Physical Properties

AlloySn63 Pb37
Odor/ScentMild

Environmental Condition

Melting Range179 °C

Supporting Information

Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorROL0
RoHS Info2011/65/EU Directive

Documents

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