M8 no clean solder paste brings performance to the next level. Developed in combination with T4 and finer mesh leaded and leadfree alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads. M8 passes stringent automotive and high reliability SIR and electrochemical test requirements.