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Shercon High Temperature Polyimide Solder Masking Disc, MFR ID KP-SH

The image shown is representative of the product family and may not specifically be the individual item.
  • MFR #:KP-SH
  • EIS #:PH22-KP-SH
  • MFR #:KP-SH
  • EIS #:PH22-KP-SH
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Polyimide tapes are typically used in electronics coating such as parylene coating, solder wave and conformal coating. They can also be used in other high temp processes such as masking gold leaves during PCB processes. - Withstands high temperatures up to 500 °F. Optimum performance in thermal insulation. Flame resistant electrical insulation.
$25.98
 - $99.84
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Polyimide tapes are typically used in electronics coating such as parylene coating, solder wave and conformal coating. They can also be used in other high temp processes such as masking gold leaves during PCB processes. - Withstands high temperatures up to 500 °F. Optimum performance in thermal insulation. Flame resistant electrical insulation.

Product Options

Showing 6 out of 6 options
The image shown is representative of the product family and may not specifically be the individual item.
Diameter
1.25 Inch
EIS Part #
KP01250
$ / Roll
Pack500/Roll
The image shown is representative of the product family and may not specifically be the individual item.
Diameter
1 Inch
EIS Part #
KP01000
$ / Roll
Pack500/Roll
The image shown is representative of the product family and may not specifically be the individual item.
Diameter
0.625 Inch
EIS Part #
KP00625
$ / Roll
Pack2000/Roll
The image shown is representative of the product family and may not specifically be the individual item.
Diameter
0.375 Inch
EIS Part #
KP00375
$ / Roll
Pack2000/Roll
The image shown is representative of the product family and may not specifically be the individual item.
Diameter
0.312 Inch
EIS Part #
KP00312
$ / Roll
Pack2000/Roll
The image shown is representative of the product family and may not specifically be the individual item.
Diameter
0.75 Inch
EIS Part #
750-KAPD0T
$ / Roll
Pack1000/Roll

Attributes

General Information

Item NameSolder Masking Disc

SeriesKP-SH

General Features

TypeHigh Temperature

Design & Construction

Adhesive TypeSilicone
Backing MaterialPolyimide
ColorAmber
ShapeDie Cut Circle

Performance Details

Flame RetardantYes

Physical Properties

Core Size3 Inch
Thickness1 Mil

Environmental Condition

ResistsFlame, Chemical
Temperature Rating260 °C