- MFR #:84351
- EIS #:84351-AIM
- MFR #:84351
- EIS #:84351-AIM
Available to Order
Min Qty:1
|Qty Increment:1
AIM’s REL61TM is comprised of tin, bismuth, silver, copper micro-element grain structure refiners. REL61 provides the electronics assembly marketplace a low-cost alternative to SAC alloys that has reliability and performance characteristics equal to SAC305 and greater than other low/no-silver solder alloys. REL61 has shown to reduce tin whisker formation as well as outperforming low/no-silver alloys in thermal shock, vibration and drop shock resistance. Lower reflow and solder pot temperature can be used with REL61 versus other low/no silver alloys.
Requires Quote / US pound
Min Qty:1
|Qty Increment:1
AIM’s REL61TM is comprised of tin, bismuth, silver, copper micro-element grain structure refiners. REL61 provides the electronics assembly marketplace a low-cost alternative to SAC alloys that has reliability and performance characteristics equal to SAC305 and greater than other low/no-silver solder alloys. REL61 has shown to reduce tin whisker formation as well as outperforming low/no-silver alloys in thermal shock, vibration and drop shock resistance. Lower reflow and solder pot temperature can be used with REL61 versus other low/no silver alloys.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSolder Bar
Trade NameAIM Solder
General Features
StandardsComplies with IPC J-STD-006
Net Weight2.5 lb
Shelf Life7 years
Storage TemperatureRoom Temperature
Design & Construction
Form100% Solid
Chemical Properties
Lead FreeYes
Physical Properties
Container Size2.5 lb
Weight2.5 lb
Environmental Condition
Melting Range208-215 C
Supporting Information
RoHS InfoYes, RoHS Compliant
Features
- Reduces Tin Whisker Formation
- Lower Reflow/Solder Pot Temperature
- Low-Cost SAC Alloy
- Improved Wetting Versus All Low/No-Silver Alloys
- For use in Lead-Free Process Only
- Complies with IPC J-STD-006
Applications
- Ideal for automotive, telecom and consumer assemblies
- Smooth uniform appearance in SMT soldering
- Lower reflow/solder pot temperature
- Reduces solder dross in selective and wave soldering applications
- For use in lead-free process only