MFR #:70-2601-0003
EIS #:RF771-30GR
Series #:RF771
MFR #:70-2601-0003
EIS #:RF771-30GR
Series #:RF771
Low Stock
Min Qty:1
|Qty Increment:1
The Kester RF771 is a medium-viscosity, water soluble flux designed for electronic component rework and repair applications. RF771 has a gel-like consistency and is easily applied by syringe dispensing. RF771 can be precisely dispensed onto a specific area that needs flux. After being dispensed, RF771 stays in place until soldering occurs. Traditional problems experienced with controlling the application of water soluble liquid fluxes are eliminated. RF771 has excellent performance in applications that require a flux having good thermal stability such as surface mount component repair. RF771 is the ideal choice for QFP or BGA semi-automated rework operations. - In addition, RF771 is well suited for use with through hole repair operations where solder fountain or controlled solder reservoir is being used for selective component removal and repair. Residues that remain on surfaces after soldering are easily removed with hot water. RF771 can be used in combination with Kester water soluble cored wire solders and water soluble solder pastes, as well as water soluble liquid fluxes, to provide the complete water soluble soldering connection.
$27.82 / Piece
Min Qty:1
|Qty Increment:1
The Kester RF771 is a medium-viscosity, water soluble flux designed for electronic component rework and repair applications. RF771 has a gel-like consistency and is easily applied by syringe dispensing. RF771 can be precisely dispensed onto a specific area that needs flux. After being dispensed, RF771 stays in place until soldering occurs. Traditional problems experienced with controlling the application of water soluble liquid fluxes are eliminated. RF771 has excellent performance in applications that require a flux having good thermal stability such as surface mount component repair. RF771 is the ideal choice for QFP or BGA semi-automated rework operations. - In addition, RF771 is well suited for use with through hole repair operations where solder fountain or controlled solder reservoir is being used for selective component removal and repair. Residues that remain on surfaces after soldering are easily removed with hot water. RF771 can be used in combination with Kester water soluble cored wire solders and water soluble solder pastes, as well as water soluble liquid fluxes, to provide the complete water soluble soldering connection.
- Attributes
- Features
Attributes
General Information
Item NameRework Flux
SeriesRF771
General Features
Shelf Life12 Months
Storage Temperature15 to 32 °C
Design & Construction
ColorAmber
Flux TypeOrganic Activated or Water Soluble
FormViscous Liquid
Chemical Properties
Chemical CompositionRosin, Organic Acid, Ethoxylated Amines, Diethanolamine, Tallow amine, Ethoxylated
Flux FormulaRF771
Physical Properties
Container Size30g
Container TypeSyringe
Odor/ScentMild
Supporting Information
Flux DesignatorORM0
RoHS Info2015/863 Directive
Features
- Compatible with HM531 solder paste
- High thermal stability
- Leaves bright/shiny solder joints after reflow