$30.02 / Piece
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The Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. - R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.
Features
- Available with lead-free alloys
- Capable of several thousands of dots per hr in high speed automated dispense equipment
- Contains halogen
- Compatible with Kester easy profile 256 stenciling solder paste
- Excellent dispensing characteristics using 22 ga needles and type 3 powder
- High activity on all substrates, including OSPs
- Manufactured and packaged void-free to insure the most consistent dispensability available
- Stable tack over 8+ hr
- Metals percentage of 86%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications
General Information
| Item Name | Lead-Free Solder Paste |
| Series | R276-SAC305-86 |
General Features
| Shelf Life | 6 Months |
| Storage Temperature | 0 to 10 °C |
Design & Construction
| Color | Silver Gray |
| Flux Type | No-Clean |
| Form | Paste |
| Particle Type | Type 3 |
Chemical Properties
| Flux Formula | R276 |
| Lead Free | Yes |
| Mesh Size | -325/+500, -400/+500 |
Physical Properties
| Alloy | Sn96.5 Ag3.0 Cu0.5 (SAC305) |
| Container Size | 35 g |
| Container Type | Syringe |
| Odor/Scent | Mild |
Environmental Condition
| Melting Range | 183 °C |
Supporting Information
| Flux Designator | ROL0 |
| RoHS Info | 2011/65/EU Directive |
Documents
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