0
0

Kester R520A Type 3 Solder Paste, Sn96.5 Ag3.0 Cu0.5 (SAC305), Silver Gray, 600g Cartridge, MFR ID 7019030811

The image shown is representative of the product family and may not specifically be the individual item.
  • MFR #:70-1903-0811
  • EIS #:SN965AG3R520A-600G
  • Series #:R520A-SAC305-89.5
  • MFR #:70-1903-0811
  • EIS #:SN965AG3R520A-600G
  • Series #:R520A-SAC305-89.5
In Stock | Ready to Ship

Min Qty:1

  |  

Qty Increment:1

This product requires overnight transport (Mon-Thurs).
more info
Temperature sensitive products require cold pack during shipping.
more info
0
0
The Kester R520A is a lead-free, organic acid, water soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A is an extremely stable water soluble formula. - R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards.
$148.31 / Piece

Min Qty:1

  |  

Qty Increment:1

This product requires overnight transport (Mon-Thurs).
more info
Temperature sensitive products require cold pack during shipping.
more info
0
0
The Kester R520A is a lead-free, organic acid, water soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A is an extremely stable water soluble formula. - R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards.

Product Options

Showing 1 out of 1 options
The image shown is representative of the product family and may not specifically be the individual item.
Container Size: 
600 g
Container Type: 
Cartridge
EIS Part #: 
SN965AG3R520A-600G
$ / Piece

Attributes

General Information

Item NameLead-Free Solder Paste

SeriesR520A-SAC305-89.5

General Features

TypeLead-Free
Shelf Life4 Months
Storage Temperature0 to 10 °C

Design & Construction

ColorSilver Gray
Flux TypeOrganic Activated or Water Soluble
FormPaste
Particle TypeType 3

Chemical Properties

Flux FormulaR520A
Lead FreeYes
Mesh Size-325/+500

Physical Properties

Container Size600 g
Container TypeCartridge
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)

Environmental Condition

Melting Range220 °C

Supporting Information

Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorORH0
RoHS Info2011/65/EU Directive