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Kester NXG1-SAC305-88.5 Type 3 Lead-Free Solder Paste

The image shown is representative of the product family and may not specifically be the individual item.

MFR #:NXG1-SAC305-88.5

EIS #:PH19-NXG1-SAC305-88.5

Series #:NXG1-SAC305-88.5

MFR #:NXG1-SAC305-88.5

EIS #:PH19-NXG1-SAC305-88.5

Series #:NXG1-SAC305-88.5

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The Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys. NXG1 is capable of stencil printing downtimes up to 120 min with an effective first print down to 0.4mm (16 mil) pitch QFPs. - NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.
$144.00
 - $146.25
Select from the options below
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The Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys. NXG1 is capable of stencil printing downtimes up to 120 min with an effective first print down to 0.4mm (16 mil) pitch QFPs. - NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.

Product Options

Showing 2 out of 2 options
The image shown is representative of the product family and may not specifically be the individual item.
Container Size
600 g
Container Type
Cartridge
EIS Part #
SN965AG3NXG1-600G
$ / Cartridge
The image shown is representative of the product family and may not specifically be the individual item.
Container Size
500 g
Container Type
Jar
EIS Part #
SN965AG3NXG1-500G
$ / Piece

Attributes

General Information
Item NameLead-Free Solder Paste
SeriesNXG1-SAC305-88.5
General Features
Shelf Life8 Months
Storage Temperature0 to 10 °C
TypeLead-Free
Design & Construction
ColorSilver Gray
Flux TypeNo-Clean
FormPaste
Particle TypeType 3
Chemical Properties
Flux FormulaNXG1
Lead FreeYes
Mesh Size-325/+500
Physical Properties
Odor/ScentMild
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Environmental Condition
Melting Range217 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorROL1
RoHS Info2011/65/EU Directive