Kester EM907-SAC305-88.5 Lead-Free Solder Paste
- MFR #EM907-SAC305-88.5
- EIS #PH19-EM907-SAC305-88.5
- Series #EM907-SAC305-88.5
$236.12 - $429.35
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The Kester EM907 is a lead-free, air and nitrogen reflow able, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys. This solder paste also exceeds the reliability standards required by J-STD-004. - EM907 is capable of stencil printing downtimes up to 60 min with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).
Features
- Capable of 60 min break times in printing
- Contains halogen
- Excellent print and reflow characteristics for 0201 applications
- Excellent printing characteristics to 16 and 20 Mils pitch
- Excellent solderability to a wide variety of surface metallizations, including Ni/Au, LM Sn and Im Ag
- High print speeds up to 150 mm/sec
- Lead-free joints that closely resemble those achieved with Sn-Pb solder paste
- Stable tack life
- Stencil life of 12+ hr (process dependent)
- Metals percentage of 88.5%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications
General Information
| Item Name | Lead-Free Solder Paste |
| Series | EM907-SAC305-88.5 |
General Features
| Type | Lead-Free |
| Shelf Life | 4 Months |
| Storage Temperature | 0 to 10 °C |
Design & Construction
| Color | Silver Gray |
| Flux Type | No-Clean |
| Form | Paste |
Chemical Properties
| Flux Formula | EM907 |
| Mesh Size | -325/+500 |
Physical Properties
| Alloy | Sn96.5 Ag3.0 Cu0.5 (SAC305) |
| Odor/Scent | Mild |
Environmental Condition
| Melting Range | 235 °C |
Supporting Information
| Applicable Materials | Stainless Steel, Molybdenum, Nickel Plated or Brass |
| Flux Designator | ROL0 |
| RoHS Info | 2011/65/EU Directive |