MFR #:EM907-SAC305-88.5
EIS #:PH19-EM907-SAC305-88.5
Series #:EM907-SAC305-88.5
MFR #:EM907-SAC305-88.5
EIS #:PH19-EM907-SAC305-88.5
Series #:EM907-SAC305-88.5
The Kester EM907 is a lead-free, air and nitrogen reflow able, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys. This solder paste also exceeds the reliability standards required by J-STD-004. - EM907 is capable of stencil printing downtimes up to 60 min with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).
$143.39
- $279.56
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The Kester EM907 is a lead-free, air and nitrogen reflow able, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys. This solder paste also exceeds the reliability standards required by J-STD-004. - EM907 is capable of stencil printing downtimes up to 60 min with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).
Product Options
Showing 4 out of 4 options
Container Size: 750g | Container Type: Cartridge | Particle Type: Type 3 | EIS Part #: SN965AG3EM907-750G | $ / Piece | ||
Container Size: 600 g | Container Type: Cartridge | Particle Type: Type 3 | EIS Part #: SN965AG3EM907-600G | $ / Piece | ||
Container Size: 500 g | Container Type: Jar | Particle Type: Type 3 | EIS Part #: SN965AG3EM907-500G | $ / Piece | ||
Container Size: 600 g | Container Type: Cartridge | Particle Type: Type 4 | EIS Part #: SN96.5EM907-600GT4 | $ / Piece |
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameLead-Free Solder Paste
SeriesEM907-SAC305-88.5
General Features
Shelf Life4 Months
Storage Temperature0 to 10 °C
TypeLead-Free
Design & Construction
ColorSilver Gray
FormPaste
Flux TypeNo-Clean
Chemical Properties
Flux FormulaEM907
Mesh Size-325/+500
Physical Properties
Odor/ScentMild
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Environmental Condition
Melting Range235 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorROL0
RoHS Info2011/65/EU Directive
Features
- Capable of 60 min break times in printing
- Contains halogen
- Excellent print and reflow characteristics for 0201 applications
- Excellent printing characteristics to 16 and 20 Mils pitch
- Excellent solderability to a wide variety of surface metallizations, including Ni/Au, LM Sn and Im Ag
- High print speeds up to 150 mm/sec
- Lead-free joints that closely resemble those achieved with Sn-Pb solder paste
- Stable tack life
- Stencil life of 12+ hr (process dependent)
- Metals percentage of 88.5%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications