The Kester EM828 is a lead-free, water soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. - Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
$163.02
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The Kester EM828 is a lead-free, water soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. - Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
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Container Size:
500 g
Container Type:
Cartridge
Particle Type:
Type 3
EIS Part #:
SN965EM828-500GC
$ / Cartridge
Container Size:
500 g
Container Type:
Jar
Particle Type:
Type 3
EIS Part #:
SN965AG3EM828-500G
$ / Piece
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Attributes
Features
Applications
Attributes
General Information
Item NameLead-Free Solder Paste
SeriesEM828-SAC305-89.5
General Features
TypeLead-Free
Shelf Life6 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorSilver Gray
Flux TypeOrganic Activated or Water Soluble
FormPaste
Chemical Properties
Flux FormulaEM828
Lead FreeYes
Mesh Size-325/+500
Physical Properties
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Odor/ScentMild
Environmental Condition
Melting Range217 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorORH1
RoHS Info2011/65/EU Directive
Features
Capable of breaks in printing of up to 60 min without any kneading
Contains halogen
Excellent wetting on a variety of metallizations
Long stencil and tack life (process dependent)
Low voiding underneath area array components
Print speed up to 150 mm/sec (6 Inch/sec)
Residues easily removed with hot DI water
Tremendous brick definition and slump resistance for reduction of bridging defects