MFR #:EM828-SAC305-89.5
EIS #:PH19-EM828-SAC305-89.5
Series #:EM828-SAC305-89.5
MFR #:EM828-SAC305-89.5
EIS #:PH19-EM828-SAC305-89.5
Series #:EM828-SAC305-89.5
The Kester EM828 is a lead-free, water soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. - Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
$140.96
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The Kester EM828 is a lead-free, water soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. - Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
Product Options
Showing 2 out of 2 options
Container Size: 500 g | Container Type: Cartridge | Particle Type: Type 3 | EIS Part #: SN965EM828-500GC | $ / Cartridge | ||
Container Size: 500 g | Container Type: Jar | Particle Type: Type 3 | EIS Part #: SN965AG3EM828-500G | $ / Piece |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameLead-Free Solder Paste
SeriesEM828-SAC305-89.5
General Features
Shelf Life6 Months
Storage Temperature0 to 10 °C
TypeLead-Free
Design & Construction
ColorSilver Gray
FormPaste
Flux TypeOrganic Activated or Water Soluble
Chemical Properties
Flux FormulaEM828
Lead FreeYes
Mesh Size-325/+500
Physical Properties
Odor/ScentMild
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Environmental Condition
Melting Range217 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorORH1
RoHS Info2011/65/EU Directive
Features
- Capable of breaks in printing of up to 60 min without any kneading
- Contains halogen
- Excellent wetting on a variety of metallizations
- Long stencil and tack life (process dependent)
- Low voiding underneath area array components
- Print speed up to 150 mm/sec (6 Inch/sec)
- Residues easily removed with hot DI water
- Tremendous brick definition and slump resistance for reduction of bridging defects
- Metals percentage of 89.5%
- Melting range of 217 to 218 °C
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications