NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements. - Produced using the same chemical composition as the solder alloy marketed as SN100C� by Nihon Superior Sha Co.,Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements.� With a melting temperature of 441�F, NT100Ge is compatible with all wave and selective solder equipment. Similar to the effect of phosphorous in Sn63 alloys, the small addition of Germanium in NT100Ge serves as a de-oxidant, which keeps drossing to a minimum.� For PCB fabrication applications such as the hot air solder leveling (HASL) process during which copper levels increase, NT100GeX provides a low-copper solder solution. NT100Ge can be used as a drop-in replacement for any existing 99C or SN100C solder bath, without the need for pot dumps or swaps. Once NT100Ge is in use, Nathan Trotter offers free, unlimited solder analysis to help maintain J-STD specifications and an optimal soldering process.